ATS-09C-72-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.19°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks, also referred to as radiators, are used to transfer heat from one component to another or to dissipate heat from a component into the atmosphere. ATS-09C-72-C3-R0 is a distributed heat sink system that is designed specifically to target and control thermal energy in compact electronic devices. This allows it to provide precise thermal management in areas where installing larger, bulkier airsinks is not feasible.

Application Field and Working Principle

ATS-09C-72-C3-R0 is a type of thermal - heat sinks, it was designed to fit into compact devices such as cell phones, tablets or wearables. It has a built-in multi-load and thermal control system that accurately regulates the temperature of devices and removes heat from them. It works by using small heat pipes and fans to project the heat away from the device. The heat pipes spread the thermal energy through the sink and the fans provide effective cooling when needed. ATS-09C-72-C3-R0 is designed to be efficiently used in multiple types of electronics, ranging from small embedded systems to larger products, such as computers and servers. It is extremely light and can be easily soldered for mounting in certain device models. Due to its small size, it easily fits into the tight spaces of the enclosure and maximizes the cooling performance for the entire system.

Benefits

One of the main benefits of ATS-09C-72-C3-R0 is its high thermal efficiency. It is designed to dissipate heat with great accuracy and effectiveness, as it can be adjusted to reach specific temperatures. Additionally, it is very lightweight, which makes it easy to transport while also saving on valuable battery life. The heat sink\'s insulating properties allow it to operate at even lower noise levels.Finally, the heat sink is extremely durable and can be used for long periods of time. It can easily endure shock, vibration and power fluctuations. It also features a low thermal resistance and high thermal conductivity, ensuring that the device is always properly cooled.

Conclusion

ATS-09C-72-C3-R0 is a highly efficient and reliable thermal - heat sink designed to provide precise thermal management in compact electronic devices. It features high thermal efficiency, light weight, low noise levels and durability. It is designed to be soldered and installed easily. ATS-09C-72-C3-R0 is a great choice for anyone looking for reliable, efficient cooling solutions in their electronics.

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