
Allicdata Part #: | ATS-09C-82-C1-R0-ND |
Manufacturer Part#: |
ATS-09C-82-C1-R0 |
Price: | $ 3.42 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X25MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.10275 |
30 +: | $ 3.01896 |
50 +: | $ 2.85125 |
100 +: | $ 2.68349 |
250 +: | $ 2.51579 |
500 +: | $ 2.43193 |
1000 +: | $ 2.18034 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.74°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction
Thermal heat sinks, or THS, are an integral part of modern electronics and have a wide range of applications. The ATS-09C-82-C1-R0 is a high-performance thermal heat sink specifically designed for use in a wide range of applications where a low-cost, self-contained solution is needed. This article provides an overview of the ATS-09C-82-C1-R0’s application field and working principle.
Application Field
The ATS-09C-82-C1-R0 is designed for use in a variety of applications, including thermal management of CPUs and GPUs, power electronics, and automotive applications. Its combination of superior performance and low weight and cost makes it an ideal choice for applications where efficient cooling is needed but space is at a premium. In addition, its ability to operate in a wide range of temperatures from -40 to +110 degrees Celsius makes it suitable for use in both cold and hot climates.
The ATS-09C-82-C1-R0 is made from aluminum alloy and offers excellent heat transfer capabilities. It is designed to meet the requirements of demanding applications, and can be used in a wide variety of electronic devices such as laptops, desktops, and servers. It is also suitable for use in a range of other situations, such as industrial control systems, power supplies, and lighting applications.
Working Principle
The ATS-09C-82-C1-R0 thermal heat sink works by dissipating the heat generated in the system. In a typical application, air is forced over the finned aluminum alloy surface mounted on the bottom of the heat sink by a fan, drawing the heat away and cooling the system. The air is then circulated through the fins, further cooling the system before being discharged. The ATS-09C-82-C1-R0 is also designed to be used with air coolers, allowing the heat sink to be used in locations where space is limited.
The ATS-09C-82-C1-R0 heat sink is designed to provide maximum cooling and efficiency. Its aluminum alloy construction is lightweight and highly durable, making it ideal for use in a wide range of extreme conditions. The fins are well-designed to provide optimum cooling, and the heat sink is also designed for ease of installation, with no additional tools needed.
In addition to its practical design, the ATS-09C-82-C1-R0 thermal heat sink offers great flexibility, with a wide range of mounting options available. It can be mounted in various configurations, allowing it to be used in a wide variety of applications. Finally, the ATS-09C-82-C1-R0 heat sink is cost effective, offering excellent value for money.
Conclusion
The ATS-09C-82-C1-R0 thermal heat sink is an ideal solution for a variety of thermal management applications. It is lightweight, cost effective, and easy to install, making it an attractive choice for a variety of projects. In addition, its superior cooling capabilities mean that it can be used in a range of extreme temperatures, making it a suitable choice for a large number of applications.
The specific data is subject to PDF, and the above content is for reference