| Allicdata Part #: | ATS-09C-82-C3-R0-ND |
| Manufacturer Part#: |
ATS-09C-82-C3-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-82-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to the function of many electronic devices. Heat sinks are used in electronics to transfer thermal energy away from sensitive components. The ATS-09C-82-C3-R0 is a thermal management solution designed to help device manufacturers maintain optimal temperatures within their products. In this article, we will discuss the application field and working principle of the ATS-09C-82-C3-R0.
The ATS-09C-82-C3-R0 is a compact heat sink that utilizes a combination of soldered aluminum fins and heat pipes in order to create a highly efficient thermal management solution. The design of the ATS-09C-82-C3-R0 takes advantage of modern thermal management techniques, such as stacked fin array construction and heat dissipation enhancement with extended fin tips. This product is designed for use in applications where space is at a premium, such as consumer electronic devices and computers.
The ATS-09C-82-C3-R0 can be used in a variety of applications, including consumer devices, gaming systems, industrial control systems, communication devices and medical equipment. This product has a wide operating temperature range, making it suitable for use in both high and low temperature environments. The thermal performance of the ATS-09C-82-C3-R0 is further enhanced by its “compact profile”, which enables it to fit in tight spaces.
The ATS-09C-82-C3-R0 is based on the principles of heat pipe technology. This thermal management solution utilizes a combination of metal capillary tubes and thermal fins in order to create a highly efficient heat exchange system. The metal capillary tubes use a wick structure, which absorbs and dissipates heat from the heated object and transports it to the fins. The fins are then used to transfer the heat to the surrounding environment, providing fast and efficient heat transfer.
The ATS-09C-82-C3-R0 can be mounted in a variety of ways and is also designed to be compatible with many types of mounting hardware. This product is also designed to maintain a level of structural integrity while operating in harsh environments, which is important for the longevity of electronic devices.
The ATS-09C-82-C3-R0 is an efficient and cost-effective thermal management solution for a variety of electronic devices and applications. This product offers excellent thermal performance and has a wide temperature range, making it suitable for use in both high and low temperature environments. The compact profile of the ATS-09C-82-C3-R0 allows it to fit into tight spaces, and the heat pipe design ensures fast and efficient heat transfer. The versatile mounting options and structural integrity make the ATS-09C-82-C3-R0 an ideal thermal management option for manufacturers.
The specific data is subject to PDF, and the above content is for reference