ATS-09C-86-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	17.72°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are devices that transfer heat away from components to maintain their optimal operating temperature. ATS-09C-86-C2-R0 is a thermal-heat sink used in various applications. This article will discuss the application field and the working principles of ATS-09C-86-C2-R0.

Application Field

ATS-09C-86-C2-R0 is a thermoelectric device used for cooling and heating in various semiconductor package components. It is commonly used in applications such as computer graphics cards, microprocessors, power converters and other devices that require an efficient thermal solution. The device is suitable for use in harsh environments such as automotive, aviation and aerospace industries, as it is resistant to vibration and shock, and is UL approved.

Thermal Design

ATS-09C-86-C2-R0 implements a two-stage cooling process. The first stage uses a closed loop passive heat pipe that exchanges heat between the device and its heatsink. The second stage employs a fan to further cool the heatsink, thereby dissipating the heat to the environment.The device has a power rating of 15 Watts, and a thermal resistance of 0.33 K/W. This means that for every watt of heat generated by the device, the amount of heat dissipated is 33% greater than that generated. This ensures that the device remains within the optimum operating temperature range.

Working Principle

The ATS-09C-86-C2-R0 utilises the Peltier Effect to achieve efficient thermal management.The Peltier Effect is a phenomenon where the heat is transferred from one side of a Peltier module to another, when electric current is passed through it. In the case of the ATS-09C-86-C2-R0, this means that one side of the Peltier module is kept at a lower temperature, while the other side is kept at a higher temperature. This creates a temperature difference across the Peltier module.As heat is transferred between the two sides of the Peltier module, the heat from the high temperature side is dissipated to the environment by the passive heat pipe and fan. This helps to maintain the device at its desired operating temperature.

Conclusion

The ATS-09C-86-C2-R0 is a thermal-heat sink used in various applications. Its application field includes computer graphics cards, microprocessors, power converters and other devices that require an efficient thermal solution. The two-stage cooling process combined with the Peltier Effect helps to maintain the device at its optimal operating temperature.

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