| Allicdata Part #: | ATS-09D-01-C3-R0-ND |
| Manufacturer Part#: |
ATS-09D-01-C3-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-01-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of any electronics system. Heat generated by electronic components and devices must be dissipated effectively to ensure reliable operation and long life. Heat sinks are one of the most effective tools for heat dissipation in the electronics industry. The ATS-09D-01-C3-R0 thermal management solution is a good example of a reliable and efficient heat sink.
The ATS-09D-01-C3-R0 heat sink consists of a small amount of copper-plated aluminum fins on an aluminum base plate. The fins are designed to promote convective and radiative heat transfer away from the surface of the heat-producing components to the fins where thermal energy is conducted away from the components. The aluminum base plate which serves as a heat spreader helps to further enhance the heat dissipation capability of this type of heat sink.
The ATS-09D-01-C3-R0 heat sink has been designed for use in a wide range of applications including LED lighting, power supplies, motors, AC/DC converters, and more. It is highly efficient at dissipating heat generated by these and other electronics components. The material construction of the fins, base plate and other components are designed to ensure a maximum life span and reliable operation over a long period of time.
One of the main advantages of the ATS-09D-01-C3-R0 is its low profile design. The fins and base plate are designed with a low height profile which makes it easy to install in tight spaces with limited clearance. In addition, this heat sink can be easily customized to meet the needs of specific applications.
The ATS-09D-01-C3-R0 can also be used in applications with higher thermal loads. The broad range of fins available for this thermal management solution provides flexibility for applications with different levels of heat dissipation requirements. For applications with more severe thermal loads, the fins can be customized to provide an improved level of performance.
The ATS-09D-01-C3-R0 heat sink is an effective thermal management solution for a wide range of applications. Its low profile design and ability to be customized make it an ideal solution for tight spaces with limited clearance. In addition, its broad range of fins provide flexibility for applications with different levels of heat dissipation requirements. All of these features combined make the ATS-09D-01-C3-R0 a reliable and efficient thermal management solution for electronics systems.
The specific data is subject to PDF, and the above content is for reference