| Allicdata Part #: | ATS15916-ND |
| Manufacturer Part#: |
ATS-09D-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used to dissipate unwanted heat generated by electronic components such as CPUs, GPUs, and FPGAs. The ATS-09D-10-C2-R0 is a type of thermal heat sink designed for high-performance thermal management. This article will explain the application field and working principle of the ATS-09D-10-C2-R0.
The ATS-09D-10-C2-R0 is designed for heavier working loads, such as military/aviation electronics, automotive electronics, industrial robotics, and any other industries that require immediate thermal dissipation. It is also suitable for applications such as high-power laser diode modules, motor drives, power transistors, and LED displays. The ATS-09D-10-C2-R0 is capable of providing excellent thermal performance at high temperatures.
The ATS-09D-10-C2-R0 is made of aluminum alloy, which has excellent thermal conductivity. The heat sink has a high fin density of 7.17 mm, which increases the effective surface area, allowing for greater heat dissipation. The heat sink also has a unique three-dimensional fin structure, which further increases the thermal management performance.
The ATS-09D-10-C2-R0 uses a combination of natural and forced convection methods to efficiently dissipate heat from the electronic components. The heat sink has an internal fan that is designed to draw in ambient air from the bottom of the heat sink. This air passes over the fins of the heat sink, helping to dissipate the heat from the floor, and is then expelled out the top of the heat sink. The fins act as additional surfaces to help dissipate the heat away from the electronic components.
The ATS-09D-10-C2-R0 also features an efficient air-cooled system, which further enhances its thermal management performance. The fan is located on the top of the heat sink and is powered by a 12V supply. The fan then forces air to move across the surface area of the heat sink, cooling the electronic components and heat sink. This air-cooled system helps to reduce the amount of heat generated by the components and heat sink.
The ATS-09D-10-C2-R0 also has an integrated thermal pad that is designed to fill any gaps between the heat sink and the component. The thermal pad functions as a heat-transfer interface between the electronic component and the heat sink, improving thermal management. The thermal pad also helps to absorb any vibration or shock from the components.
Overall, the ATS-09D-10-C2-R0 is an excellent thermal heat sink designed for high-performance thermal management. It is capable of providing efficient cooling for heavy working loads, laser diode modules, motor drives, and LEDs. The combination of natural and forced convection, along with the integrated air-cooled system and thermal pad, makes the ATS-09D-10-C2-R0 an ideal choice for dissipating heat and ensuring that electronic components perform optimally.
The specific data is subject to PDF, and the above content is for reference