| Allicdata Part #: | ATS-09D-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-09D-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Introduction to ATS-09D-116-C3-R0 Thermal - Heat Sinks
Thermal - Heat Sinks are composed of heat-dissipating materials such as metal or ceramic. They are designed to dissipate heat away from components of an electronic system, usually through convection or radiation. One type of thermal - heat sink is the ATS-09D-116-C3-R0 manufactured by A&R Engineering.
Application Field of ATS-09D-116-C3-R0 Thermal - Heat Sinks
The ATS-09D-116-C3-R0 is suitable for use in many applications. It is typically used for cooling electronics components in industrial and commercial systems. It is an ideal choice for electronic control systems, monitoring systems, communications systems, and computers. The ATS-09D-116-C3-R0 is suitable for use in many applications including medical equipment, computers, laptops, and other electronic and medical equipment.
Working Principle of ATS-09D-116-C3-R0 Thermal - Heat Sinks
The ATS-09D-116-C3-R0 works by dissipating heat away from electronic components when the operating temperature exceeds the rated temperature. It is designed to help prevent electronic components from overheating and potentially experiencing long-term damage. The thermal - heat sink\'s base is made up of high performance base metals and the fins are manufactured with advanced aluminum and ceramic materials, which helps to ensure a consistent thermal heat dissipation. The fins are also designed to direct the air away from the components, further aiding in cooling.
The ATS-09D-116-C3-R0 has an air flow rate of 40 CFM, which helps to ensure that enough cool air reaches the surface of the component for cooling. The air flow rate is also balanced to allow for a controllable maximum temperature of the electronic component. The ATS-09D-116-C3-R0 also has a unique shape, compared to other thermal - heat sinks, which helps to increase the air flow rate even further, resulting in composed cooling.
In addition, the ATS-09D-116-C3-R0 has features that enable it to be used in a wide range of temperatures. It is designed to operate in a temperature range between -40°F to +158°F and has a -rated dissipation of 0.24 W/°C. The ATS-09D-116-C3-R0 is designed to work perfectly with many heat sinks, fans, and other cooling components to maximize its cooling potential.
Conclusion
The ATS-09D-116-C3-R0 thermal - heat sink is a highly efficient cooling solution for many applications and environments. It has been designed to operate with a wide range of temperatures and has excellent cooling capability. Its advanced design and composition ensure that it can dissipate large amounts of heat and prevent any electronic components from over-heating. The ATS-09D-116-C3-R0 is an ideal choice for commercial and industrial systems that require reliable and efficient cooling.
The specific data is subject to PDF, and the above content is for reference