ATS-09D-139-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.03°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are an important component in the design of any electronic system. They provide a vital link between the heat generated by the components and the environment. The ATS-09D-139-C1-R0 is one such component and is mainly used in data systems, power supplies and other sensitive applications. This article will provide an overview of the application field and working principle of the ATS-09D-139-C1-R0.

Application Field of ATS-09D-139-C1-R0

The ATS-09D-139-C1-R0 is designed to be used in data systems, power supplies and other sensitive applications. In data systems, it is used to manage the heat generated by the system\'s main computer chips. In power supplies, it helps regulate the temperature of components such as transformers, transistors, MOSFETs and other heat-generating components. It is also commonly used in other sensitive applications such as medical devices, automotive electronics, consumer electronics, and industrial electronics.

Working Principle of ATS-09D-139-C1-R0

The ATS-09D-139-C1-R0 is designed to dissipate heat generated by components in an electronic system. It does this by using a combination of high thermal conductivity materials and passive methods of cooling. The thermal conductor of the ATS-09D-139-C1-R0 is made of either copper or aluminum, which are good thermal conductors. This means that heat generated by components can be transferred quickly away from the hot spot and into the air.The passive methods of cooling used by the ATS-09D-139-C1-R0 include air convection and heat pipe technology. Air convection is the process of using the natural flow of air to direct heat away from hot components. Heat pipes are used to transfer heat away from components by using a small amount of water, which is then evaporated and resolidified at the other end of the heat pipe. This process allows heat to be distributed evenly and efficiently.In addition, the ATS-09D-139-C1-R0 also uses a combination of aluminum material and fins to improve the cooling efficiency. The aluminum material helps dissipate the heat generated while the fins act as a convection channel that allows air to flow freely around the heat sink, thus improving the cooling efficiency.

Conclusion

As its name suggests, the ATS-09D-139-C1-R0 is designed to be used in thermal - heat sink applications. It is mainly used in data systems, power supplies and other sensitive applications. It uses a combination of high thermal conductivity materials and passive methods of cooling to dissipate heat away from components in an electronic system. The combination of aluminum material and fins also helps to improve the overall cooling efficiency of the heat sink.

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