| Allicdata Part #: | ATS-09D-139-C3-R0-ND |
| Manufacturer Part#: |
ATS-09D-139-C3-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-139-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The use of heat sinks has long been a key part of thermal and cooling solutions in today\'s electronics industry. The ATS-09D-139-C3-R0 is one such heat sink that has become an integral part of cooling solutions for high power requirements, utilising a combination of aluminum fins and copper rods and a multitude of mounting points.
Application Field
This heat sink is commonly used in applications such as industrial electronics, medical equipment, power supplies, amplifiers, home theatres, as well as high end gaming systems. Its dimensions provide for flexibility within the electronic cabinet and it can be mounted on either side or the back of the cabinet with ease.
The ATS-09D-139-C3-R0 has an impressive dissipation capability, with its 120W thermal load capacity and its minimum dissipation resistance of 0.71 °C/W. This makes it suitable for heat management and improved cooling solutions in machines that are work for extended periods of time or operating under high loads.
Working Principle
The working principle of the ATS-09D-139-C3-R0 heat sink is to dissipate the heat generated by an internal component using the expanding air currents assisted by the geometry of the fins and copper rods. The aluminum fins absorb the heat from the internal component and act as thermal bridges that facilitate efficient heat transfer.
The copper rods connected between the fins also help to dissipate the heat by distributing it evenly across the surface. The combination of these features makes the ATS-09D-139-C3-R0 an optimal choice for cooling applications that require high performance.
Additionally, the ATS-09D-139-C3-R0 has four mounting points located on the sides of the heat sink. This enables it to be attached to the internal component with an optimal mounting position that is further bolstered by the unique clip locking system used to secure the mounting points. This provides an added layer of protection and stability needed for efficient heat transfer.
Conclusion
The ATS-09D-139-C3-R0 is a heat sink that has become a mainstay in the thermal and cooling solutions used in modern electronics applications. Its ability to deliver high performance cooling solutions and offer multiple mounting points makes it an attractive option for applications that require high performance and efficient heat transfer. Its impressive dissipation capability and unique clip locking system make it an ideal solution for high power application, providing engineers with a reliable and dependable solution.
The specific data is subject to PDF, and the above content is for reference