| Allicdata Part #: | ATS-09D-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-09D-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal-Heat Sinks are one of the most versatile cooling products available in the market, and the ATS-09D-15-C3-R0 is an ideal choice for various applications. There are two main components to an ATS-09D-15-C3-R0 Heat Sink, the heat plate and heat-sink fins. The heat plate is the base of the Heat Sink, which absorbs most of the heat. The fins, in turn, act as heat radiators, dissipating the heat quickly and efficiently.
One of the main applications of an ATS-09D-15-C3-R0 Heat Sink is in cooling of electronic devices. By absorbing the heat generated by the electronic components and dissipating it quickly, it provides prolonged life for the device. The ATS-09D-15-C3-R0, with its aluminum fins and copper base, is durable and has good heat-dissipation characteristics. It also has excellent thermal stress resistance, making it ideal for high-performance applications.
The Heat Sink is also widely used in cooling of power semiconductor components, such as transistors and diodes. It is also an ideal choice for cooling of IGBTs, MOSFETs and other high power components. By dissipating the heat generated by these components, a Heat Sink ensures proper functioning of the circuit and prolonged life of these components.
Another application of an ATS-09D-15-C3-R0 Heat Sink is in manufacturing of temperature-controlled printing devices. The Heat Sink helps in keeping the temperature of the device constant, while ensuring reliable performance and smooth operation. It also ensures smooth and accurate results.
The working principle of an ATS-09D-15-C3-R0 Heat Sink is very simple. Heat from the device is first absorbed by the heat plate and then dissipated quickly through the aluminum fins. The heat dissipation capacity of this Heat Sink is very high, as it has a large surface area exposed to the cooling air. The airflow across the fins also helps in increasing the efficiency of the heat dissipation.
In conclusion, the ATS-09D-15-C3-R0 Heat Sink is ideal for a wide variety of applications, including cooling of electronic devices, power semiconductor components, and temperature-controlled printing devices. It has a simple working principle, which ensures efficient heat dissipation and prolonged life for these devices. With its aluminum fins and copper base, it is both durable and has excellent thermal stress resistance, making it ideal for high-performance applications.
The specific data is subject to PDF, and the above content is for reference