| Allicdata Part #: | ATS-09D-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-09D-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of any modern electronic design. Heat sinks provide an effective way to remove heat from sensitive components and ensure that system temperature remains balanced. The ATS-09D-153-C1-R0 is a heat sink designed to manage the temperature of components in various applications.
The ATS-09D-153-C1-R0 is a highly efficient device that utilizes the combination of a finned aluminum extrusion, a heatpipe, and heat spreaders to allow for greater heat transfer from components to the ambient air. This type of thermal management gives the device the ability to handle currents up to 11.5 amps and temperatures over 200 ºC. The ATS-09D-153-C1-R0 is also UL certified, ensuring that it is safe to use in applications that require UL certification.
The ATS-09D-153-C1-R0 is suitable for a variety of applications, including servers, laptops, cell phones, and embedded systems. It is also suitable for applications such as automobiles, medical devices, and industrial applications. This heat sink provides superior thermal performance due to its design which allows for increased thermal capacity, improved heat dissipation, and longer life.
The ATS-09D-153-C1-R0 heat sink is designed with a two-part assembly that includes the extrusion and the heat spreader. The extrusion features a finned aluminum structure with heatpipe technology which allows for efficient heat transfer from the components to the ambient air. The heat spreader features a copper sheet that helps to evenly distribute heat from the extrusion to the other parts of the device. This ensures that the heat is evenly spread across the device, allowing for improved thermal performance.
The working principle of the ATS-09D-153-C1-R0 is the conduction of heat away from the components. Heat is transferred through the finned aluminum extrusion and the heat spreader to dissipate heat from the system. The fin structure of the extrusion eliminates the need for an additional fan, allowing for greater thermal performance and lower power consumption.
The ATS-09D-153-C1-R0 is designed to meet the stringent requirements of high-end applications while offering reliable thermal performance. The device is also designed to be easily installed and serviced, making it ideal for use in a wide range of applications. The device is UL certified and fully compliant with CE and RoHS standards, ensuring that it is safe to use in any application.
In conclusion, the ATS-09D-153-C1-R0 heat sink is a reliable and efficient thermal solution for a variety of applications. Its two-part assembly offers superior thermal performance and increased thermal capacity, making it ideal for use in a wide range of applications. The device is UL certified and compliant with CE and RoHS standards, ensuring that it is safe to use in any application. With its superior performance and reliability, the ATS-09D-153-C1-R0 is an ideal choice for anyone who needs an effective thermal solution.
The specific data is subject to PDF, and the above content is for reference