| Allicdata Part #: | ATS-09D-167-C1-R0-ND |
| Manufacturer Part#: |
ATS-09D-167-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-167-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-09D-167-C1-R0 thermal-heat sink is a critical component in many electronics systems. It is designed to remove heat from electronic components, and dissipate it away from the system, improving its performance and reliability. Heat sinks are typically made of metal, which has good thermal properties.
ATS-09D-167-C1-R0 thermal-heat sink is designed to efficiently dissipate heat from electronic components, and is often used in computers, handheld electronic devices, and other electronic systems. The heat sink is made up of multiple layers of aluminum, copper, and other metals. The metal layers are designed to form a lattice-like structure, allowing heat generated by electronic components to be easily transferred to the heat sink. The heat sink also contains fins, which increase the total surface area of the heat sink, allowing it to dissipate heat more quickly and efficiently.
When used in a circuit with other electron components, the ATS-09D-167-C1-R0 thermal-heat sink works by absorbing the heat generated by the components and dissipating it away from the system. In most situations, the heat dissipated by the heat sink does not have to be actively cooled, and can instead by dissipated into the environment. This type of heat sink is designed to be lightweight, low-cost, and effective at dissipating heat. It can also be adapted to fit in a variety of different environments.
The ATS-09D-167-C1-R0 thermal-heat sink is typically installed in an enclosure, such as a computer case or a circuit panel. It is usually mounted on the motherboard, or another metal surface, to ensure good thermal conductivity. It is also generally surrounded by air to allow it to dissipate heat efficiently. When the heat sink is installed, the thermal-conductive material should be able to transfer heat away from the system, providing a lower internal temperature.
In many systems, the ATS-09D-167-C1-R0 thermal-heat sink will also be fitted with a fan, or other cooling device, to help reduce the temperature of the system further. This helps to ensure that the temperature of the system components is maintained at an acceptable level. Heat sinks can also be fitted with devices such as sensors, which monitor the temperature of the system, and can be used to shut down the system if the temperature becomes too high.
The ATS-09D-167-C1-R0 thermal-heat sink is a versatile and effective way to improve the performance and reliability of electronics systems. It is designed to be lightweight, effective and affordable, and can be adapted to fit in a variety of different environments. The heat sink is typically used in combination with a cooling fan, or other cooling device, to help reduce the temperature of the system further.
The specific data is subject to PDF, and the above content is for reference