| Allicdata Part #: | ATS-09D-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-09D-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-09D-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks: ATS-09D-17-C3-R0 Application Field And Working Principle
Thermal Heat Sinks are devices that allow the dissipation of heat from electronic or electrical components. The ATS-09D-17-C3-R0 is a thermal heat sink from Alumaseel, designed with a curved base for air-cooling and features 17 fins for efficient heat dissipation.
The ATS-09D-17-C3-R0 has a wide range of applications, including computer-related devices such as CPUs and GPUs, as well as other high-performance devices like automotive electronics. The heat sink is also suitable for telecommunications and industrial automation applications. With its efficient heat dissipation, the ATS-09D-17-C3-R0 ensures that these devices operate at optimal levels and remain cool.
The working principle of the ATS-09D-17-C3-R0 is simple. The thermal heat sink consists of a base and multiple fins, which are connected to one another. As the device dissipates heat, the fins pull air upwards, thereby cooling the device and allowing the heat to dissipate at a faster rate. Additionally, the curved nature of the base further enables the heat to cycle away from the device.
The ATS-09D-17-C3-R0 features a unique three-dimensional curved fin mechanism that increases the efficiency of heat dissipation. The curved fin profile gives the thermal heat sink larger heat dissipation area that is 30% more than regular thermal fin shapes. The increased area helps pull more air during heat dissipation and reduces the contact resistance. The heat sink also features groove width that is 28% less than regular 0.20 mm width, thus reducing the weight of the device and increasing the fin surface area and air velocity.
The ATS-09D-17-C3-R0 can also efficiently and effectively operate under a wide range of environmental conditions. The device is designed to operate with the temperature range of -40 degrees Celsius to 120 degrees Celsius and relative humidity range between 0% to 85%. The device can also resist erosion and corrosion caused by chemicals used in various applications.
In summary, the ATS-09D-17-C3-R0 thermal heat sink from Alumaseel is an efficient and effective device for cooling electronic and electrical components. It offers increased heat dissipation over traditional heat sinks and features a three-dimensional curved fin mechanism for optimized performance. The device is suitable for a wide range of applications including computers, automotive electronics, telecommunications and industrial automation, and it is designed to operate under a wide range of environmental conditions.
The specific data is subject to PDF, and the above content is for reference
ATS-09D-17-C3-R0 Datasheet/PDF