| Allicdata Part #: | ATS-09D-170-C3-R0-ND |
| Manufacturer Part#: |
ATS-09D-170-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-170-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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As the world in technology rapidly advances, thermal management is becoming a more and more important field. Heat sinks, or heat dispersal components, are a key part of any thermal management system. The ATS-09D-170-C3-R0 is a versatile thermal heat sink that is suitable for a wide variety of applications. In this article, we will take a look at the field of application of the ATS-09D-170-C3-R0, as well as its working principle.
The ATS-09D-170-C3-R0 is a thermal heat sink designed for efficient thermal management of both low and medium-power devices. It is made of a durable aluminum alloy that ensures it is able to effectively dissipate heat, while being lightweight and small in size. It is a popular choice for applications that require a reliable and efficient heat sink.
The ATS-09D-170-C3-R0 is suitable for both commercial and industrial applications. It is a great choice for thermal management of consumer electronics, such as laptops, video game consoles, and phone chargers. It is also suitable for industrial applications, such as computer servers, networking equipment, and industrial control systems.
The ATS-09D-170-C3-R0 utilizes a patented dual-zone cooling technology that allows efficient cooling in two separate areas of the heat sink. This allows it to effectively dissipate heat away from all components in the thermal management system. Additionally, the heat sink is able to self-regulate its cooling, allowing it to adjust to varying thermal loads efficiently.
The ATS-09D-170-C3-R0 is a highly efficient heat sink due to its patented cooling technology. It is able to dissipate heat from all components in the system simultaneously, with minimal energy consumption. This makes it a great choice for both commercial and industrial applications.
Furthermore, the ATS-09D-170-C3-R0 is also a great choice for high-impedance applications, as it is able to dissipate heat without additional cooling fans. This makes it suitable for applications where fans or other cooling devices are not feasible.
The ATS-09D-170-C3-R0 is an excellent choice for a variety of thermal management applications. Its patented cooling technology makes it a great choice for both commercial and industrial applications, while its efficiency and reliability makes it suitable for high-impedance applications. It is lightweight and small in size, allowing for easy installation in confined spaces. All in all, the ATS-09D-170-C3-R0 is a great choice for any thermal management system.
The specific data is subject to PDF, and the above content is for reference