| Allicdata Part #: | ATS-09D-175-C1-R0-ND |
| Manufacturer Part#: |
ATS-09D-175-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-175-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for any electronic system, be it a personal computer or an industrial one. One thermal management tool is a heat sink, which transfers heat away from a hot area to a cooler one, usually by dissipating it into the environment. Using a heat sink can reduce heat buildup in areas that experience higher levels of ambient temperature or in areas that generate high levels of heat. ATS-09D-175-C1-R0 is one such heat sink device, and it is used in many industrial applications to manage heat and improve device performance.
The ATS-09D-175-C1-R0 heat sink comprises a compact, all-aluminum frame with thermal fins, constructed with special grooves to enhance performance. It is available in low profile and open designs. The fins are designed to allow increased surface area for dissipating heat, which is then released through two or more small air vents at the rear of the frame. The vents can be adjusted and customized for greater efficiency, as needed.
The ATS-09D-175-C1-R0 heat sink is suitable for use in a wide range of applications, from heat exchangers and solar panels to medical imaging devices and defense electronics. In industries such as table saws, grinders, or lathes, the treaded thermal fins provide maximum strength for efficient heat dissipation. At the same time, the multiple air vents ensure cooler running temperatures of devices placed within the frame. The heat sink can be mounted in either an upright or horizontal position, thanks to its universal hole pattern. The frames are also stackable for further scalability.
In terms of working principles, the ATS-09D-175-C1-R0 heat sink effectively transfers heat away from the source of generation into its fins and then dissipates it into the environment. The heat sink functions by using an aluminum-based material for the fins, which offers excellent thermal conductivity, and a heat sink compound to provide a sturdy connection between the fins and the source. The fins also provide a larger surface area to allow for maximum heat dissipation. With the help of the vents, the heat dissipated from the fins is then released into the atmosphere, helping cool the device.
Finally, the ATS-09D-175-C1-R0 heat sink offers several advantages that make it a great choice for any application. Not only does it provide efficient cooling to improve device performance, but also it helps save energy and reduce the wear and tear on electronics caused by heat buildup. It is also easy to install and requires minimal maintenance. With these advantages, the ATS-09D-175-C1-R0 heat sink is definitely a valuable choice when it comes to thermal management.
The specific data is subject to PDF, and the above content is for reference