| Allicdata Part #: | ATS-09D-176-C1-R0-ND |
| Manufacturer Part#: |
ATS-09D-176-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-176-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions are essential in today’s devices for electronic components to work reliably. In most cases, the use of thermal heat sinks and cooling solutions is necessary to prevent the overheating of electronic components. The ATS-09D-176-C1-R0 is one such cooling device designed to provide efficient thermal management and reliable performance for many applications.
The ATS-09D-176-C1-R0 is a thermal - heat sink solution featuring low profile design to ensure accurate and reliable performance. It is constructed with an aluminum body along with copper fins, which help to dissipate heat and keep the components cool. The device has an overall dimension of 176mm x 175mm x 65mm and weighs only 320g.
The ATS-09D-176-C1-R0 can be used in a variety of applications, including embedded systems, telecommunications, high-density data storage, medical diagnostics, and virtualization. In addition, it is designed to be compatible with a wide variety of CPUs, memory chips, GPUs, and other electronic components.
The ATS-09D-176-C1-R0 is designed to provide efficient heat conduction. It utilizes a standard heat sink configuration in the form of an aluminum block and copper fins. The aluminum block is responsible for absorbing and dissipating heat from the components while the copper fins work to efficiently disperse this heat away from the block. In addition, the device is also designed with air-duct vents that help ensure efficient air flow and cooling.
The ATS-09D-176-C1-R0 also features a clip-on fan bracket and fan guard for additional cooling. The fan bracket is designed to work with a variety of 40mm fans while the fan guard helps to protect the components from dust and debris. The device is also designed with a black anodized finish to resist corrosion.
In order to ensure efficient operation, the ATS-09D-176-C1-R0 is designed with an efficient mounting system. It utilizes a special mounting clip that can be installed on either side of the heat sink to allow for easy installation. The device also utilizes brass screws to secure the mounting clips to the heat sink, ensuring a firm and secure fit.
The ATS-09D-176-C1-R0 is an efficient thermal - heat sink solution that can provide reliable performance in many applications. With its low profile design and efficient mounting system, the device is designed to be compatible with a wide variety of electronic components and CPUs. In addition, the device also utilizes a standard heat sink configuration to ensure effective heat conductivity and efficient cooling. With all these features, the ATS-09D-176-C1-R0 is an ideal choice for reliable thermal management solutions.
The specific data is subject to PDF, and the above content is for reference