| Allicdata Part #: | ATS-09D-180-C3-R0-ND |
| Manufacturer Part#: |
ATS-09D-180-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-180-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks have grown in popularity over the years as a means of efficiently dissipating the large amount of heat energy generated by modern electronics. The ATS-09D-180-C3-R0 is at the forefront of this burgeoning technology, using an innovative air-flow design to achieve highly efficient heat dissipation.
The ATS-09D-180-C3-R0 is a specialized heat sink designed to optimize the air-flow around components. It incorporates a unique honeycomb-like pattern of aluminum fins, which puts more surface area in contact with the air to better dissipate heat. The fins have also been designed to be dense enough to maximize heat transfer while minimizing the resistance to airflow.
An added benefit of the ATS-09D-180-C3-R0 heat sink is its efficient airflow. This is achieved through an overhanging design that allows the air to flow through the fins with minimal turbulence, resulting in more effective heat dissipation. Additionally, the fins are arranged in a pattern that allows the air to move in a swirling, vortex-like effect, further enhancing the heat transfer process.
The ATS-09D-180-C3-R0 heat sink is ideal for cooling equipment that generate a large amount of heat, such as power supplies, processors, and electrical switches. It is also well-suited to applications where the space is limited. The low profile design of the heat sink allows it to fit into tight spaces without sacrificing the cooling efficiency.
The primary application of the ATS-09D-180-C3-R0 is cooling electronic components. However, it can also be used for other purposes such as cooling fluid reservoirs, aiding in heat exchange processes. Additionally, the heat sink can be used to balance temperature in larger systems, when used in conjunction with cooling fans.
The ATS-09D-180-C3-R0 is designed to provide superior heat dissipation performance. It utilizes an innovative air-flow design to maximize the heat transfer from the components to the surrounding air. The efficient airflow allows for more effective cooling, even in cramped spaces. Additionally, it can be used in conjunction with cooling fans to provide balanced temperature for larger systems. The ATS-09D-180-C3-R0 is the perfect choice for any application requiring effective and efficient thermal management.
The specific data is subject to PDF, and the above content is for reference