ATS-09D-36-C1-R0

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Thermal-Heat Sinks are essential components needed to reduce the effects of heat on electronic components. The ATS-09D-36-C1-R0 is a type of Thermal-Heat Sink developed by Alpha and Omega Semiconductors. This sink is capable of discharging 80 watts per square meter in an efficient and cost effective manner. The ATS-09D-36-C1-R0 Thermal-Heat Sink is designed to provide superior thermal solution as an ideal choice to dissipate heat from adjacent electrical components.

The main application field for the ATS-09D-36-C1-R0 Thermal-Heat Sink is in power electronics such as transistors, MOSFETs, diodes, sensors, and other devices. The sink has a cooling capacity of 80 Watts per square meter, which is suitable for operating temperatures up to 125°C. The Thermal-Heat Sink can be used in a variety of high energy consuming applications, such as power supplies, amplifiers, motors, and other applications.

The ATS-09D-36-C1-R0 Thermal-Heat Sink is designed to offer good heat dissipation through a combination of construction and material properties. The Thermal-Heat Sink is made of aluminum, which has good heat conduction properties. The sink also features a fin array, which increases the surface area available for cooling. The fins are designed to take maximum advantage of the surrounding airflow, allowing for the best possible cooling performance. The sink is then further optimized for increased efficiency and more efficient heat transfer by using special heat pipes, which are designed to direct the heat to the area of highest need.

Additionally, the ATS-09D-36-C1-R0 Thermal-Heat Sink also features multi-stage cooling, which is enabled by up to four layers of materials that help to distribute the heat. The first layer consists of the aluminum block that is in contact with the component, while the other two layers are made of copper and aluminum, respectively. The fourth layer is made of an extruded aluminum that fins, which improves the air exchange and cooling performance. This layering method allows for the efficient heat removal up to 200 Watt/meter² maximum.

The working principle of the ATS-09D-36-C1-R0 Thermal-Heat Sink is based on the heat transfer through conduction. Heat is transferred from the component to the surrounding environment through the material the component is in contact with. This material then conducts the heat away from the component and into the sink where it is then dissipated into the surrounding atmosphere. The high thermal conductivity of the sink material ensures an efficient transfer of heat which is then dissipated into the surrounding atmosphere.

In conclusion, the ATS-09D-36-C1-R0 Thermal-Heat Sink is a reliable and efficient solution for reducing the effects of heat on electronic components. It is designed for applications that are subjected to high thermal loads up to 125°C. The sink is made of aluminum with a fin array, as well as special heat pipes and multi-stage cooling. It is designed to provide superior thermal solution, allowing for efficient heat transfer and high cooling efficiency. The ATS-09D-36-C1-R0 Thermal-Heat Sink is an ideal choice for applications that require reliable thermal management.

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