ATS-09D-41-C2-R0

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Thermal solutions such as ATS-09D-41-C2-R0 are essential components in a variety of electronics systems and are available in a wide selection of configurations and sizes. As their name suggests, these thermal solutions, also referred to as “Heat Sinks”, are designed to absorb and dissipate heat generated from electronic components. The ATS-09D-41-C2-R0 in particular is designed for applications requiring lightweight, low profile, higher thermal-range operation, and efficient heat dissipation.

Heat Sinks are used to manage components like CPUs, GPUs, integrated circuits, photovoltaic cells, and lasers, or to cover entire assemblies such as cabinet systems or power conversion technologies. Thermal solutions like the ATS series, are designed to meet the special demands of the application.

The ATS-09D-41-C2-R0 is specifically designed to dissipate heat from components and assemblies operating in higher temperature applications. This Heat Sink utilizes a patented "Single Loop Sided Heat Constant" design, which enables a thermal path with a high thermal conductivity, a low thermal resistance, and a low thermal impedance.

The Single Loop Sided Heat Constant design utilizes a base plate and a multiple loop attachment. The base plate is made from aluminum or other high thermal conductivity material and is bolted to the circuit board, providing a uniform thermal resistance over a large area. The multiple loop attachment then wraps around the base plate and helps to dissipate heat quickly and effectively. This design also increases the thermal stability of the heat sink, ensuring consistent performance in high temperature environments.

The ATS-09D-41-C2-R0 also features a unique pin fin design which further increases the thermal efficiency of the heat sink. The pin fin design includes fins which assist in heat dissipation and promote air circulation over the components, allowing for heat to be dissipated more effectively. The fins also provide increased surface area to improve heat transfer and cooling.

The ATS-09D-41-C2-R0 also combines a nickel-plated copper heat spreader with an optimized heat sink base to ensure maximum thermal performance. This heat spreader helps to reduce component junction temperatures, increasing the reliability and lifetime of the electronics in which it is used. The combined design of the ATS-09D-41-C2-R0 results in superior heat dissipation, superior thermal stability, and increased component reliability.

In summary, thermal solutions such as the ATS-09D-41-C2-R0 are essential components in high temperature electronics and assembly systems. By utilizing the Single Loop Sided Heat Constant design and the pin fin design, the ATS-09D-41-C2-R0 achieves maximum thermal performance, improved component reliability, and superior heat dissipation in high temperature environments.

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