| Allicdata Part #: | ATS-09D-64-C3-R0-ND |
| Manufacturer Part#: |
ATS-09D-64-C3-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09D-64-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.92112 |
| 30 +: | $ 3.70335 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.49°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-09D-64-C3-R0 is a thermal - heat sink device that is designed to help dissipate the heat energy of a device by helping to draw away the hottest air produced by that device and cool it through the device\'s active heat sink system. It has a low profile design, making it ideal to fit into tight or crowded spaces, and it is lightweight and easy to transport. The device\'s power consumption is also very low, as its compact size means that it does not require much power to operate.The ATS-09D-64-C3-R0 has two primary components - the heat sink and the fan. The heat sink is designed to take in the hottest air produced by the device, and draw it away from the device\'s electronics and components. This means that the device\'s electronics and components remain at a much lower temperature, resulting in fewer malfunctions and a longer lifespan for the device. The fan, meanwhile, is designed to act as a ventilation system, keeping the air flowing away from the device and helping to ensure that the device remains well-ventilated and does not overheat.The ATS-09D-64-C3-R0 is typically used in a variety of applications, such as gaming consoles, electronics, automotive, medical, industrial, and civilian applications. It is also ideal for applications that require small-space thermal solutions, as the device\'s dimensions are appropriate for tight spaces.The device is also designed for use with a wide range of thermal management solutions, such as heat pipes, heatsinks, fan-assisted cooling, thermal pads, and more. It is also suitable for use with a variety of systems, including but not limited to desktop computers, laptops, thin-client systems, and mobile devices.The ATS-09D-64-C3-R0 is designed to be easy to install. The package includes instructions on how to install the device and configure it for your system\'s needs. The device operates best when used with a regulated power supply and should be kept away form sources of moisture to ensure optimal performance.In addition to its application field being diverse, the ATS-09D-64-C3-R0 offers an incredibly efficient performance. It is designed to take out a minimum of 75 watts of thermal energy, while still offering reliable and consistent cooling performance.Overall, the ATS-09D-64-C3-R0 is a reliable and efficient thermal solution for a wide range of applications. It offers up to 75 watts of thermal energy reduction without compromising on performance, and its lightweight and easy-to-install nature make it ideal for those who need a compact and efficient thermal management solution.
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