ATS-09E-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09E-10-C1-R0-ND

Manufacturer Part#:

ATS-09E-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09E-10-C1-R0 datasheetATS-09E-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com


ATS-09E-10-C1-R0 is a thermal-heat sink, typically applied to electronic equipment to improve its cooling efficiency. Heat sinks dissipate thermal energy from components and other devices into the surrounding air. In addition to heat dissipation, heat sinks aid in preventing the formation of thermal hotspots on the surface of the components. Heat sinks are an integral part of the cooling systems for most electronic components, computers, and other equipment.

The ATS-09E-10-C1-R0 is a heat sink designed to dissipate a large amount of heat. It is constructed of high quality aluminum and is designed to dissipate heat than other heat sinks. This makes it ideal for applications where heat dissipation is a priority. It also features a flat top design for improved performance and larger heat dissipation area, and it can be mounted with a set screw or with a standard hex nut.

Heat sinks are most commonly used on CPUs, GPUs, and ASIC chips. Using a heat sink on these components helps to keep them cooler and prevent overheating. The thermal resistance, or the temperature difference between the component and the ambient air, of the ATS-09E-10-C1-R0 is 0.1°C/w, making it ideal for cooling hot components and regulating internal temperatures of those devices.

The working principle of a heat sink is quite simple. Heat is moved from the component to the heat sink via conduction. The heat sink then dissipates the heat out into the surrounding environment. The heat is dissipated either through convection (movement of warm air away from the heat sink) or radiation (direct emission of heat into the environment).

The ATS-09E-10-C1-R0 is also designed to be used with fans. The fan increases the airflow over the heat sink, improving its cooling efficiency. The fan can also be set to different speeds, depending upon the amount of cooling required. This makes it an ideal cooling solution for systems with high ambient temperatures.

In conclusion, the ATS-09E-10-C1-R0 is an excellent heat sink for thermal-heat dissipation applications. It is constructed of high quality aluminum and has an impressive thermal resistance rating of 0.1°C/w. It is also designed to be used with fans for improved heat dissipation. The ATS-09E-10-C1-R0 is a reliable and affordable solution for keeping components cool.


The specific data is subject to PDF, and the above content is for reference

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