ATS-09E-100-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09E-100-C1-R0-ND

Manufacturer Part#:

ATS-09E-100-C1-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09E-100-C1-R0 datasheetATS-09E-100-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.69°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an essential component in many thermal management systems. Thermal control is critical for many electronic applications, such as consumer electronics, industrial automation, medical devices and computer systems. The key to efficient thermal management is selecting the right heatsink. The ATS-09E-100-C1-R0 is a thermal heat sink specifically designed for low profile applications such as motherboard, gaming devices, medical equipment, and computer systems.

The ATS-09E-100-C1-R0 is constructed with a copper base and aluminum fins, which helps to dissipate heat quickly and efficiently. The fins are designed to allow for optimal air circulation and heat dissipation, and are arranged in an offset pattern to allow for unobstructed airflow. The heat sink is also designed with a low profile for maximum compatibility with a wide range of electronic systems.

The ATS-09E-100-C1-R0 is designed to be used with a CPU fan or other cooling device. The heat sink is capable of dissipating up to 100 Watts of heat, making it an ideal solution for high-powered electronics applications. The heat sink is compatible with Intel and AMD sockets, making it a versatile option for multiple types of systems.

The ATS-09E-100-C1-R0 utilizes a direct-contact heat pipe technology to ensure maximum heat dissipation. This method uses a copper heat pipe directly connecting the CPU to the aluminum fins of the heatsink, which results in increased thermal performance and reduced thermal resistance. The heat pipe also eliminates the need for a fan, allowing for a quieter cooling system.

The ATS-09E-100-C1-R0 also features an adjustable airflow guide, which helps to increase thermal performance by directing the airflow to the desired areas on the surface of the heatsink. Additionally, the adjustable guide allows for customization of the cooling effect, allowing users to fine-tune their thermal management setup.

The ATS-09E-100-C1-R0 is an effective and versatile thermal heat sink designed to provide efficient heat dissipation and improved compatibility with a wide range of electronics systems. Its low profile, direct contact heatpipe technology, and adjustable airflow guide make it an ideal choice for low-profile applications such as motherboards, gaming devices, medical equipment, and computer systems.

The specific data is subject to PDF, and the above content is for reference

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