| Allicdata Part #: | ATS16132-ND |
| Manufacturer Part#: |
ATS-09E-116-C2-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-116-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.43350 |
| 10 +: | $ 3.34026 |
| 25 +: | $ 3.25030 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical part of the design of any electronic device. The ATS-09E-116-C2-R0 is a heat sink that is designed to help manage the heat generated by components that have to be cooled in order to operate correctly. This type of heat sink is a popular choice for many applications.The ATS-09E-116-C2-R0 is a small, lightweight, and highly effective heat sink. It is designed to provide an efficient means of dissipating the heat generated by small to medium sized electronic components. The design of the heat sink is such that it helps the components to operate at optimal temperatures without the need for complex cooling mechanisms.The ATS-09E-116-C2-R0 is composed of a thin sheet of thermal material, which functions as a barrier layer between the components and the environment. This thermal material is designed to absorb and dissipate the heat generated by the components. It also helps to reduce the thermal radiation from the components, thus helping to keep the environment cool.The ATS-09E-116-C2-R0 is designed to be attached to a surface with mounting holes. This allows the heat sink to be easily and securely attached to the surface. Once the heat sink is attached, it is then fastened to the component(s) using a mounting bracket. This helps to ensure the heat is dissipated through the heat sink rather than being trapped in the component.The ATS-09E-116-C2-R0 is also designed with a black anodized finish which helps to reduce the amount of thermal radiation coming from the heat sink. This is important because too much thermal radiation can cause the environment to become too hot, which can cause damage to the components. The black anodize finish also provides greater durability and longevity for the heat sink.The ATS-09E-116-C2-R0 is designed to be used in a number of different applications. It is an ideal choice for applications in the automotive, computer, consumer electronics, and telecommunications industries. The heat sink can be used to manage the heat generated by power supplies, processors, audio amplifiers, and other components.The ATS-09E-116-C2-R0 is an efficient and effective thermal management solution. It is a popular choice for many applications due to its small size, lightweight design, and high degree of effectiveness. The design of the heat sink makes it an ideal choice for applications in which components require to be cooled in order to function correctly.
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