| Allicdata Part #: | ATS-09E-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-09E-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are a crucial but overlooked part of numerous electronics, from computers to tablets and phones. The ATS-09E-117-C1-R0 is a particularly effective and efficient heat sink, designed to be integrated with laptops and other portable electronics. It is also important to understand the application fields and working principles of the ATS-09E-117-C1-R0 before using it.
The main application field of the ATS-09E-117-C1-R0 is laptops and other portable electronics. The small size and compact design ensure that it fits comfortably inside the housing of most laptops and other electronics, making it an ideal choice for portable uses. The heat sink is also designed to be compatible with laptop CPUs from several makes and models, such as Intel Core, AMD Ryzen, and Qualcomm Snapdragon. Furthermore, the ATS-09E-117-C1-R0 is designed for optimal heat dissipation of up to 20 watts.
The inherent nature of heat sinks is that they are designed to dissipate heat from electronics, and the ATS-09E-117-C1-R0 is no exception. The design of the ATS-09E-117-C1-R0 is based on a thermal management system that employs two layers of heat sinks, the first made of aluminum, and the second made of an aluminum-zinc hybrid material. The aluminum-zinc hybrid was specifically selected because it provides higher heat resistance than many alternatives.
The aluminum heat sink also features fins that allow for increased air circulation, thus allowing more efficient heat dissipation. The design of the ATS-09E-117-C1-R0 also makes use of thermal pads that create direct contact between the heat sink and the CPU, allowing for more efficient heat absorption. This is further augmented by the aluminum-zinc hybrid layer, which acts as a buffer between the CPU and the aluminum heat sink. By creating a strong connection between the CPU and the heat sink itself, the ATS-09E-117-C1-R0 can dissipate heat more efficiently than many other alternatives.
As a result of its efficient heat dissipation capabilities, the ATS-09E-117-C1-R0 is a particularly effective heat sink for laptop and other portable electronics. Its slim design makes it ideal for integrating into compact laptops and other electronics. Furthermore, its aluminum-zinc hybrid layer provides increased heat resistance and efficient heat absorption. By understanding its application fields and working principles, among other factors, it becomes apparent that the ATS-09E-117-C1-R0 is a reliable and effective thermal management solution.
The specific data is subject to PDF, and the above content is for reference