ATS-09E-124-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09E-124-C1-R0-ND

Manufacturer Part#:

ATS-09E-124-C1-R0

Price: $ 3.49
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09E-124-C1-R0 datasheetATS-09E-124-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.17394
30 +: $ 3.08826
50 +: $ 2.91677
100 +: $ 2.74516
250 +: $ 2.57363
500 +: $ 2.48783
1000 +: $ 2.23047
Stock 1000Can Ship Immediately
$ 3.49
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.16°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

Heat sinks are one of the most common and important components when it comes to cooling electronic and mechanical systems. They are designed to absorb and dissipate heat from parts of a system or device. Heat sinks come in many different sizes and designs, and they are usually made from aluminum or copper.

AT&S\' ATS-09E-124-C1-R0 is a heat sink designed for use in a variety of applications. It features a 1.24 meter tall profile with two vertical fins and an anodized-aluminum frame. The fins have a heat dissipating area of 9.8 cm2 and provide air flow and heat transfer protection to surrounding components. The frame has an embedded 4,398 mm2 thermal dissipation area, and the total thermal dissipation area is rated at 14,742 mm2. This heat sink is particularly suitable for applications such as high frequency power amplifiers and medical equipment.

In terms of its working principle, the ATS-09E-124-C1-R0 does not operate differently from other heat sinks. It works by dissipating heat from components into the surrounding air. Thermal transfer occurs through the fins of the heat sink, which increase the contact area between the hot components and the air. The fins also act as barriers, preventing the heated air from circulating back into the device.

The performance of the heat sink can also be improved by using different materials. For example, aluminum is better at dissipating heat than copper, but it is less durable and has a narrower temperature range. Similarly, copper can dissipate more heat, but its weight and cost are often prohibitive. This is why AT&S selected an anodized aluminum frame for the ATS-09E-124-C1-R0 as it balances cost and performance effectively for the target application.

Overall, the ATS-09E-124-C1-R0 is an efficient and reliable heat sink suitable for a wide range of applications. It is designed to quickly and effectively dissipate heat from components, protecting them and their surroundings from thermal overload. Its vertical fins and aluminum frame make it lightweight and easy to install, while its large thermal dissipation area ensures that components are effectively cooled.

The specific data is subject to PDF, and the above content is for reference

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