| Allicdata Part #: | ATS-09E-138-C1-R0-ND |
| Manufacturer Part#: |
ATS-09E-138-C1-R0 |
| Price: | $ 3.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-138-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.77011 |
| 30 +: | $ 2.69514 |
| 50 +: | $ 2.54533 |
| 100 +: | $ 2.39564 |
| 250 +: | $ 2.24590 |
| 500 +: | $ 2.17103 |
| 1000 +: | $ 1.94643 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor for efficient and reliable operation of electronic devices. This is especially true due to the high current loads and component densities in modern electronics, which generate a large amount of heat and cause the device to become inefficient and potentially dangerous. Heat sinks are used to dissipate this thermal energy quickly and safely to prevent the device from overheating and damaging associated components.
The ATS-09E-138-C1-R0 heat sink is one of the most popular and reliable heat sinks used for thermal management. It is constructed from a rugged aluminum alloy and is designed for low-noise operation in environments up to 160°C. It features a unique shape that is designed to increase its surface area and allow for greater heat dissipation. It has a large profile and is specifically designed to efficiently dissipate heat away from the center of the component.
The ATS-09E-138-C1-R0 is typically used to cool high current loads, such as power supplies, processors, and FPGAs. It can also be used as part of a larger cooling system, such as one that includes fans, air-cooled heat sinks, and liquid cooling systems. It can be used in a wide range of applications, including electronic devices, automotive systems, flight control systems, and industrial machinery. It is also well-suited for high-temperature environments, such as those found in medical and military applications.
The ATS-09E-138-C1-R0\'s efficient, low-noise operation is due to its unique design. The heat sink is constructed from an aluminum alloy that features channels to increase its surface area. This allows it to dissipate the heat quickly and evenly. Additionally, the channels are specifically designed to reduce turbulence as air passes through them, which helps to reduce noise levels and ensure peak performance. It is also designed to be easily mounted onto a variety of board designs, making it highly versatile.
The ATS-09E-138-C1-R0 is a reliable and efficient heat sink that is perfect for any electronic device that requires controlled temperature management. It is constructed to be both low-noise and efficient, allowing for maximum cooling performance in extreme environments. It is also designed for easy mounting and can be used in a variety of applications, making it an ideal choice for cooling high current loads and other electronic components.
The specific data is subject to PDF, and the above content is for reference