ATS-09E-14-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important aspect of many electronics applications, and heat sinks can provide critical thermal management functionality in numerous situations. The ATS-09E-14-C1-R0 heat sink provides a unique combination of features ideal for many specific applications, along with a robust design that makes it well-suited to general-purpose thermal management solutions. This article will explore the ATS-09E-14-C1-R0 heat sink in more detail, discussing its application field and working principle.

Heat Sink Overview

The ATS-09E-14-C1-R0 is a cost-effective, high-performance thermal management solution ideal for many industrial and consumer electronics designs. This heat sink has a top fin area of 14 in², making it perfect for use in devices with limited space availability. Its aluminum base ensures excellent thermal transfer, and its grooved fin design helps to maximize heat dissipation. The ATS-09E-14-C1-R0 also features a 5/16-24 UNC rivet hole arrangement, along with a mounting arm to simplify installation. The heat sink has an overall height of 0.41 inches and has an operating temperature range of -40℃ to 85℃.

Application Field

In many applications, the ATS-09E-14-C1-R0 is used as part of a larger, more complex thermal management system. This heat sink is commonly used in connected devices, including 3D printers, routers, and other home appliances. In addition, the ATS-09E-14-C1-R0 is often used in medical or industrial applications including medical devices, heart rate monitors, and blood pressure monitors – areas where the reliability of the thermal management system is of paramount importance. The ATS-09E-14-C1-R0 can also be used as part of a custom-designed thermal management system, due to its ability to be combined with other thermal management elements such as fans or heat pipes.

Working Principle

The ATS-09E-14-C1-R0 operates using a standard, passive two-stage heat transfer process. This process begins when heat is generated by the mounted electronic component, which effectively “pumps” heat through the heat sink. Next, the ATS-09E-14-C1-R0 heat sink’s grooved fins quickly distribute this heat away from the source, storing it in its aluminum base. This heat is then transferred away from the heat sink base, through the thermal management system, and ultimately released into the environment.

The ATS-09E-14-C1-R0 is designed to provide a high thermal efficiency, low weight, and low resistance to air flow. As a result, it’s able to more effectively dissipate the heat generated by mounted components, allowing manufacturers to design better, more reliable products. This heat sink has been thoroughly tested to ensure its performance and durability, making it a great choice for applications ranging from consumer electronics to medical and industrial solutions.

Conclusion

The ATS-09E-14-C1-R0 is a versatile, reliable, and robust heat sink perfect for a wide range of applications. Its grooved fin design helps to maximize air flow and heat transfer, while its aluminum base ensures excellent thermal transfer. This heat sink is easy to mount and can be used as part of a custom-designed thermal management system. Thanks to its cost-effectiveness, robust design, and long-term performance, the ATS-09E-14-C1-R0 heat sink is a great choice for almost any thermal management system.

The specific data is subject to PDF, and the above content is for reference