| Allicdata Part #: | ATS-09E-148-C1-R0-ND |
| Manufacturer Part#: |
ATS-09E-148-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-148-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important issue in modern electronics. Heat generated by electronic components must be dissipated adequately, if not, the equipment will often malfunction or become damaged. One option for dissipating heat is the use of heat sinks. ATS-09E-148-C1-R0 is a type of heat sink suitable for thermal management in several applications.
The ATS-09E-148-C1-R0 is constructed of aluminum, with a thermal conductivity of 183 W/mK. The aluminum fins are arrayed in a hexagonal, pin fin design, and serve to increase the surface area available for conduction. The ATS-09E-148-C1-R0 is equipped with a mounting clip for ease of installation and comes with an anodized nickel-plated finish that is corrosion resistant. The heat sink is capable of dissipating 64.61 Watts of thermal energy.
The ATS-09E-148-C1-R0 has several applications that provide ample benefit when it comes to better thermal management. The heat sink is suitable for heat-generating components such as LCD backlight modules, power amplifier modules, and microprocessors. The ATS-09E-148-C1-R0 can also be used in telecommunications applications, including outdoor base stations and signal processing modules.
The working principle of the ATS-09E-148-C1-R0 is that heat generated by a component is conducted to the device’s metal body, where it is then absorbed by the ATS-09E-148-C1-R0’s aluminum fins. As the fins absorb heat, air flowing across them cools the fins, carrying away the heat from the device. The design of the heatsink also helps to increase the air flow over the fins, thus increasing the efficiency of heat dissipation.
The ATS-09E-148-C1-R0 is an effective heat sink designed to provide cooling capability for electronic components in several applications. Its aluminum construction is corrosion-resistant and its hexagonal pin fin design serves to increase the surface area available for conduction. The ATS-09E-148-C1-R0 has several applications such as power amplifier modules, LCD backlight modules, and microprocessors, and its operating principle is based on the conduction of heat from the component to the heat sink followed by passive cooling from air flow.
The specific data is subject to PDF, and the above content is for reference