ATS-09E-16-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09E-16-C1-R0-ND

Manufacturer Part#:

ATS-09E-16-C1-R0

Price: $ 3.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09E-16-C1-R0 datasheetATS-09E-16-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.23379
30 +: $ 3.14622
50 +: $ 2.97133
100 +: $ 2.79657
250 +: $ 2.62181
500 +: $ 2.53441
1000 +: $ 2.27223
Stock 1000Can Ship Immediately
$ 3.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an essential component when cooling high-power electronics. ATS-09E-16-C1-R0 thermal heat sinks are specifically designed for industrial, commercial, and consumer electronics that require some type of cooling during normal operations.

The ATS-09E-16-C1-R0 is manufactured from aluminum that is coated to protect it from corrosion and electrical shorts. It has extended fins, a built-in thermal pad, and a unique design that increases its surface area and allows for a greater airflow when cooling. This heat sink also features thermally efficient construction and can withstand temperatures ranging from -55 to +155 degrees Celsius. It is rated to dissipate up to 35 Watts of heat, making it suitable for most applications.

The working principle of the ATS-09E-16-C1-R0 thermal heat sink is relatively simple. It utilises the standard principals of thermal management. When a device runs, it produces some sort of heat. This energy is then transferred to the surrounding environment via a combination of conduction, convection and radiation. Heat sinks are designed to facilitate this process by increasing the surface area on the device, allowing the heat to dissipate more efficiently.

When used in combination with fans, the ATS-09E-16-C1-R0 is able to efficiently and effectively cool components ranging from processors to power supplies. By using a fan in combination with the heat sink, higher throughput temperatures can be reached, thus increasing the operational life of the components. Additionally, the ability to dissipate heat quickly and efficiently helps to ensure that the device remains within its optimal operating temperature range, thus preventing any permanent damage to the component.

The ATS-09E-16-C1-R0 thermal heat sink is an ideal choice for cooling a variety of components ranging from processors to power supplies. It is designed to effectively dissipate heat, while being compact and lightweight. Additionally, its aluminium construction makes it effective for dissipating temperatures ranging from -55 to +155 degrees Celsius. This makes it suitable for a range of applications in the commercial, industrial, and consumer electronics settings.

The specific data is subject to PDF, and the above content is for reference

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