| Allicdata Part #: | ATS-09E-16-C3-R0-ND |
| Manufacturer Part#: |
ATS-09E-16-C3-R0 |
| Price: | $ 4.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-16-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.73590 |
| 30 +: | $ 3.52842 |
| 50 +: | $ 3.32098 |
| 100 +: | $ 3.11340 |
| 250 +: | $ 2.90584 |
| 500 +: | $ 2.69828 |
| 1000 +: | $ 2.64639 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is an essential component that is designed to dissipate the heat generated from electronic components such as processors, integrated circuits, LEDs and many more. There are many types of heat sinks available today, but the ATS-09E-16-C3-R0 is one of the most popular and widely used.
The ATS-09E-16-C3-R0 is a high performance, cost-effective heat sink designed to dissipate heat from processor chip sets and other high power components. It features a patented high efficiency design that ensures maximum heat dissipation and long-term operational stability. The ATS-09E-16-C3-R0 is made using a high performance anodized aluminum construction with a unique airflow design for added cooling efficiency. It also features a black anodized finish to enhance its aesthetics and corrosion resistance properties.
The ATS-09E-16-C3-R0 has a standard size of 16mm x 16mm and is compatible with most processor chip sets. It is designed for maximum performance and features a high quality thermal resistance rating of 0.75°C/W. This rating ensures that heat is efficiently transferred from the processor to the heat sink without any unnecessary delays. In addition, the heat sink has an optimized airflow design that provides maximum cooling performance and longer lifespan.
The ATS-09E-16-C3-R0 works by using two methods to dissipate heat: direct conduction and air flow. The direct conduction method works by transferring the heat generated by the processor into the aluminum construction of the heat sink, which is then quickly transferred away from the processor and dispersed via air flow. This ensures that the processor is kept at an optimal temperature without suffering from any thermal delays.
The air flow method works by using fans to draw air across the heat sink and help dissipate the heat generated by the processor. The fans draw air from inside the case and blow it out through the fins of the heat sink. This helps to reduce the overall temperature of the processor and ensures that it remains within the acceptable range.
The ATS-09E-16-C3-R0 is a great choice for any system that requires maximum thermal efficiency and performance. It is ideal for high performance systems that require a reliable and efficient heat sink to keep the processor functioning at its best. This heat sink is also easy to install and requires minimal maintenance, making it a great option for those who need a reliable and cost-effective solution.
The specific data is subject to PDF, and the above content is for reference