| Allicdata Part #: | ATS-09E-196-C3-R0-ND |
| Manufacturer Part#: |
ATS-09E-196-C3-R0 |
| Price: | $ 3.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-196-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.15063 |
| 30 +: | $ 3.06516 |
| 50 +: | $ 2.89498 |
| 100 +: | $ 2.72462 |
| 250 +: | $ 2.55435 |
| 500 +: | $ 2.46919 |
| 1000 +: | $ 2.21376 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is necessary for efficient and safe operation of electrical and electronic components. Heat-sinking is one of the most important processes used to remove unwanted heat from a component and disperse it through the surrounding environment. In this area, ATS-09E-196-C3-R0 is a popular heat sink for thermal management applications.
ATS-09E-196-C3-R0 is a high performance heat sink designed for use in power conversion and control systems. It has an efficiency rating of up to 95% and is designed to effectively dissipate heat with minimal power loss. The design of this heat sink makes it suitable for applications in which space is limited, such as with personal electronics, mobile phones, and laptops.
The most common application of the ATS-09E-196-C3-R0 is in the cooling of power semiconductor devices. It is typically placed on top of the power device, between the device and the chassis, and uses air flow to remove heat from the device. The heat is then dissipated to the surrounding environment. This type of thermal management is advantageous in that it is simple and efficient, and allows the device to remain compact.
The ATS-09E-196-C3-R0 features several design elements that make it effective and reliable in typical Power Conversion and Control (PCC) applications. It has two cylindrical heat-sink fins at the top that maximize the surface area available for thermal dissipation. This allows for a higher rate of conduction, thus facilitating an efficient heat transfer from the component to the ambient air. Additionally, the aluminum heat sink base provides mechanical support to ensure good contact with the device, as well as acting as a heat spreader.
The main working principle of the ATS-09E-196-C3-R0 is to dissipate heat by increasing the surface area exposed to the air. Through air convection, the heat sink is able to transfer the heat from the component to the surrounding environment. This is accomplished by a combination of thermal resistance and air flow velocity. The heat sink fins increase the surface area exposed to the air, which increases the air velocity and thus the thermal resistance. Additionally, the fins can be bent to further increase the surface area exposed to the air flow, which further increases the thermal resistance, thus minimizing the power loss.
In summary, the ATS-09E-196-C3-R0 is a high-performance heat sink designed specifically for power conversion and control applications. It is an effective and reliable thermal management solution that uses air convection to dissipate heat from the component to the surrounding environment. The two cylindrical fins increase the surface area exposed to the air flow, thus increasing the thermal resistance and minimizing the power loss.
The specific data is subject to PDF, and the above content is for reference