ATS-09E-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-09E-20-C3-R0-ND

Manufacturer Part#:

ATS-09E-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09E-20-C3-R0 datasheetATS-09E-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for a variety of electronic applications to ensure that components remain safe and operational. Heat sinks are critical devices in this area, designed to transfer heat away from components, regulate temeprature, and protect critical electronics from potential damage. ATS-09E-20-C3-R0 is a heat sink manufactured by ADLInc, designed for harsh environmental conditions and extreme temperatures. It is known for its compact size and intended for a broad range of heating solutions. Let\'s take a look at the application field of ATS-09E-20-C3-R0 and its working principle.

Application Field

The ATS-09E-20-C3-R0 heat sink is ideal for power electronic devices such as power transistors, MOSFETs, power modules, thyristors, and others. Its small footprint and efficient heat dissipation make it suitable for space-constrained applications. The wide temperature range ensures reliable operation in environments with temperatures as low as -40°C and as high as +85°C. The ATS-09E-20-C3-R0 is also designed to withstand impacts and vibration. The shock tolerance of the device is up to 1000G and the resonance frequency is 10–4000Hz.

The heat sink is designed for use in a range of industrial applications such as automotive, telecommunication, industrial control systems, optoelectronics, and many others. It is suitable for general-purpose power electronic applications such as power supplies, precision control systems, home appliance, and illumination. It is also ideal for medical devices, nuclear reactors, and wind power generators.

Working Principle

The ATS-09E-20-C3-R0 heat sink features a low profile design with a small thermal resistance. It is constructed with a die-cast aluminum shell that houses a central thermal core. The core is made of high-quality thermal materials and is suspended in a die-cast aluminum chassis. It features a modular design that can easily be mounted onto a variety of surfaces. The thermal core is made up of numerous layers of interlaced radiators that maximize heat transfer.

The heat sink has a built-in enclosure that reduces the risk of damage and ensures protection of delicate components. The thermal core features fins that disperse heat evenly throughout the entire heat sink. The fins are designed to direct most of the heat away from the source, preventing overheating. The inner core of the ATS-09E-20-C3-R0 heat sink features multiple micro-vias for additional heat dissipation.

The ATS-09E-20-C3-R0 heat sink features embedded heat pipes for optimum thermal performance. Heat pipes are copper tubes that transfer heat from the base directly to the fins. This efficient heat transfer ensures that thermal energy is spread evenly, optimizing the overall cooling performance of the device. The heat sink also features brackets for easy and secure mounting in different application settings.

The ATS-09E-20-C3-R0 heat sink is a highly efficient and reliable device designed for a variety of electronic applications. Its modular design, wide temperature range, shockproof and vibration-proof construction make it a perfect choice for a range of industrial and commercial applications. The device is also designed to be dust- and water-proof, making it ideal for use in harsh environmental conditions.

The specific data is subject to PDF, and the above content is for reference

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