ATS-09E-27-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-09E-27-C3-R0-ND

Manufacturer Part#:

ATS-09E-27-C3-R0

Price: $ 7.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09E-27-C3-R0 datasheetATS-09E-27-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.51231
30 +: $ 6.15027
50 +: $ 5.78857
100 +: $ 5.42676
250 +: $ 5.06498
500 +: $ 4.70319
1000 +: $ 4.61275
Stock 1000Can Ship Immediately
$ 7.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.28°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are designed to absorb and dissipate heat away from the environment or object. More specifically, the ATS-09E-27-C3-R0 thermal-heat sink is designed to be a one-stop solution which can radiate heat up to 1000°C in less than 15 minutes. It is given this high performance values as the thermal-heat sink is manufactured with materials that have the thermal conductivity rate (inversely proportional to the thermal diffusivity) that is second to none. It is equipped with a lightweight aluminum enclosure with a dielectric nano-coating which effectively dissipates heat away from the ATS-09E-27-C3-R0 model.

The main advantage of the ATS-09E-27-C3-R0 thermal-heat sink is the size and weight ratio that it carries with itself. It is incredibly lightweight and compact, making it perfect for applications in tight spaces. Furthermore, the thermal-heat sink is especially designed to be installed within high temperature ranges up to 1000°C which provides a one-stop solution that helps with the distribution of heat away from the enclosure making it suitable for use in a variety of settings.

ATs-09E-27-C3-R0 thermal-heat sink works on a simple principle that describes the exchange of heat between two different materials. Heat is transferred across the thermal-heat sink by one of three methods, namely convection, conduction and radiation. The mechanism behind each process can be simply explained as follows:

Convection: Convection occurs when hot air near an object rises, taking the heat with it. The heat dissipates into the air, thus cooling the object. This method is used in the ATS-09E-27-C3-R0 model as the internal fan will blow air across the surface of the heat sink, cooling it in the process.

Conduction: Conduction is the transfer of heat from one object to another through direct contact. In the ATS-09E-27-C3-R0 model, this is through the transfer of heat from the heat source to the heat sink via contact.

Radiation: Radiation is the transfer of heat through waves which move out from the source of heat in a straight line. This method can be used in the ATS-09E-27-C3-R0 model, for example, a high-powered laser device can be mounted to the heat sink so that it radiates heat to the surface of the sink.

In summary, the ATS-09E-27-C3-R0 thermal-heat sink is an efficient solution for applications that require a lightweight and compact dissipating device. Its enclosed aluminum design and dielectric nano-coating material helps to effectively radiate and transfer hot air away from the environment or object. With its small size and weight, it can be easily mounted in tight spaces and is capable of handling high temperature regimes up to 1000°C. The ATS-09E-27-C3-R0 thermal-heat sink uses the principles of conduction, convection and radiation to transfer heat away from the heat source, making it an ideal choice for many applications.

The specific data is subject to PDF, and the above content is for reference

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