| Allicdata Part #: | ATS-37700-ND |
| Manufacturer Part#: |
ATS-09E-41-C2-R0 |
| Price: | $ 7.04 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-41-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.33780 |
| 10 +: | $ 6.16518 |
| 25 +: | $ 5.82271 |
| 50 +: | $ 5.48012 |
| 100 +: | $ 5.13759 |
| 250 +: | $ 4.79508 |
| 500 +: | $ 4.45257 |
| 1000 +: | $ 4.36695 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management applications are essential for any technological advances. Heat generated by the internal components of the device must be adequately dissipated so that the device can function without overheating. One of the most efficient components used for thermal management is the ATS-09E-41-C2-R0 heat sink. This product is a combination of thermal conductivity and advanced air flow management, and can be very effective when used correctly. In this article, we will discuss the application field and working principle of the ATS-09E-41-C2-R0 heat sink.
The ATS-09E-41-C2-R0 is a heat sink designed for use with electronics such as CPUs, GPUs, and other similar devices. It consists of a base and several heat pipes, and is designed to provide maximum cooling for the device while using minimal space. The heat pipes have a high thermal conductivity, so they are able to efficiently dissipate the heat generated by the components into the surrounding atmosphere.
When using the ATS-09E-41-C2-R0, it is important to ensure that the heat pipes are properly connected to the device. Also, the heat pipes should be connected to a radiative heat distributor, which is designed to disperse the heat throughout the system, and not just to the air surrounding the device. Proper air flow through the device is also important, so a fan should be used in combination with the heat sink to ensure that the heat can be effectively dissipated.
Once all of the components are properly connected and installed, the working principle of the ATS-09E-41-C2-R0 becomes quite simple. The heat generated by the device is caught by the heat pipes, which then transfer the heat away from the device and into the atmosphere. The radiative heat distributor helps to ensure that the heat is distributed evenly throughout the system. Finally, the fan helps to ensure that the heat is effectively dissipated into the atmosphere, cooling the system in the process.
The ATS-09E-41-C2-R0 is a highly effective thermal management system for any electronics device. It is small enough to fit into tight spaces, so it is the perfect solution for devices where space is limited. The efficient thermal conductivity and advanced airflow management of the radiator allow it to provide maximum cooling with minimal space. It is well-suited for any device that requires efficient heat transfer, such as CPUs, GPUs, and other similar devices.
The specific data is subject to PDF, and the above content is for reference