ATS-09E-50-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	19.22°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-09E-50-C3-R0 Thermal - Heat Sinks

Thermal - Heat Sinks are used to keep components cool with their ability to dissipate heat from moving parts. The ATS-09E-50-C3-R0 is a thermal - heat sink that is designed to dissipate large amounts of heat generated by integrated circuits and other electronic components. It is made of aluminum heatsink bars that are abstracted to a high surface area in order to increase the dissipation capacity. The abstracted bars increase the surface area of the heat sink, and thus increasing the rate of heat transfer. The ATS-09E-50-C3-R0 is a high-performance and convenient thermal - heat sink designed for use with high-power electronic components. It is designed to absorb and dissipate high-power heat loads quickly and effectively. It features an integrated aluminum cartridge body which helps reduce electrical and thermal resistance in large-scale components. The wave pattern on the fins increases its surface area which increases its efficiency in dissipating heat at higher temperatures. Additionally, pre-drilled steel mounting screws make installation easy and fast, while the extended base area improves the overall thermal performance.The ATS-09E-50-C3-R0 is designed for applications where thermal resistance of the components and system is a top priority. Its advanced design provides efficient heat transfer with superior cooling capacity. Additionally, it supports a wide range of embedded and portable applications such as industrial systems, medical equipment, IoT, automotive, process control, embedded systems, telecom/datalink systems, and digital displays. This thermal - heat sink is also designed for an array of high-power application such as industrial computers, embedded computers, LED lightings, home appliances, and automotive electronics. It offers better cooling efficiency and helps minimize thermal resistance due to its unique fin structure. The fins are spaced further away from the base area, letting air flow freely around the entire surface. This heat sink also features a sleek design with no visible screw heads, making it aesthetically pleasing. Additionally, it comes with high-efficiency thermal paste that is designed to increase the thermal transfer between the heated component and the heat sink. The ATS-09E-50-C3-R0 thermal - heat sink component is designed to provide excellent performance in any application. Its unique wave-shaped fin design increases the surface area for better cooling performance, while its integrated aluminum body provides high efficiency and low thermal resistance. The high-performance thermal paste provided with the package ensures maximum heat transfer from the component to the heat sink, while the pre-drilled screws make the installation process easier and faster. Thanks to its outstanding combination of features, it is the ideal choice for applications where thermal performance and long-term performance are paramount.

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