ATS-09E-56-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS16259-ND

Manufacturer Part#:

ATS-09E-56-C2-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X15MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09E-56-C2-R0 datasheetATS-09E-56-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.56580
10 +: $ 3.47004
25 +: $ 3.27726
50 +: $ 3.08448
100 +: $ 2.89170
250 +: $ 2.69892
500 +: $ 2.50614
1000 +: $ 2.45794
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 17.72°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an integral part of system reliability and performance. Heat sinks are an essential component used in dissipating and transferring heat away from a hot spot, or area, and into the surrounding environment. The ATS-09E-56-C2-R0 is a heat sink specifically designed for the applications of cooling computer components, including but not limited to CPUs, GPUs, memory, power supplies, and hard drives.

The ATS-09E-56-C2-R0 heat sink is made from a combination of high-grade aluminum alloy and copper. The components are connected together via some very high-quality soldered joints and then polished to a high sheen with epoxy-based compounds for added protection. The combination of aluminum and copper gives the ATS-09E-56-C2-R0 excellent thermal conductivity, higher heat dissipation than a comparable single-material heat sink, and a greater surface area.

The ATS-09E-56-C2-R0 offers good flexibility for both installation and maintenance. It features several easy-to-operate clips and links that can be adjusted and replaced without the need for additional tools. There\'s also a built-in thermal pad which adds extra heat dissipation. Despite its small size, the ATS-09E-56-C2-R0 is capable of taking a higher load than its larger competitors, making it an excellent choice for heavy-duty applications.

When it comes to the working principle, the ATS-09E-56-C2-R0 functions by absorbing heat from the hot component before transferring it away from the core of the computer. The heat is then dissipated away from the core and into the surrounding environment using the heat sink. This is made possible by the combination of aluminum and copper components, which act as effective heat spreaders and allow for more efficient heat transfer and dissipation.

In conclusion, the ATS-09E-56-C2-R0 is a high-performance and reliable heat sink specifically designed for the cooling of computer components. It features an easy-to-operate design, a high thermal capacity, and excellent heat dissipation capabilities.

The specific data is subject to PDF, and the above content is for reference

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