| Allicdata Part #: | ATS-09E-82-C3-R0-ND |
| Manufacturer Part#: |
ATS-09E-82-C3-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09E-82-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration in electronics design and cooling needs to be adequately addressed for problem-free operation. One popular type of thermal management device is the heat sink. The ATS-09E-82-C3-R0 is a heat sink that is designed to optimize cooling performance for various temperatures and application fields.
This heat sink is a two-piece design, with a top and bottom part. The top part is the main heat-dissipating surface, made of extruded aluminum. The bottom part is the mounting surface, which is also made of aluminum but with an anodized finish for improved corrosion protection. The bottom part has mounting points that allow it to be easily mounted on components.
The ATS-09E-82-C3-R0 features a number of features that optimize its cooling performance. First, the top part is designed with fins that provide a large heat-dissipating surface area. This increases the amount of heat that the heat sink can remove from the component being cooled. Second, the fins are made with a special design that maximizes air flow and provides greater cooling efficiency. Finally, the upper and lower parts of the heat sink are connected with thermal pads that help to transfer the heat from the component to the heat sink.
The working principle of this heat sink is simple. Heat from the components flows through the thermal pads and is then dissipated through the fins of the heat sink. This results in a controlled and efficient cooling of the components. The heat sink itself is cooled by the air in the environment, which is then dissipated into the environment.
The ATS-09E-82-C3-R0 can be used in a variety of applications. It is designed to dissipate large amounts of heat, making it suitable for high-power electronics such as CPUs and GPUs. It is also suitable for use in cooling medical instruments and industrial equipment. Furthermore, it can be used in a wide range of temperatures and environments, making it versatile and suitable for use in a variety of situations.
In conclusion, the ATS-09E-82-C3-R0 is a highly efficient heat sink that is designed to optimize cooling performance in a variety of application fields and temperatures. Its two-piece design and specialized fins maximize air flow and heat-dissipation, resulting in a cooling solution that is both effective and reliable. Additionally, its versatile design makes it suitable for use in different environments and temperatures, making it an ideal choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference