| Allicdata Part #: | ATS-09F-01-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-01-C3-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-01-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are designed to remove or dissipate heat from an electronic component or assembly. ATS-09F-01-C3-R0 is a type of thermal heat sink that is designed for a wide variety of applications. It is constructed with a thermally efficient extruded aluminum profile and a robust heat sink machined base. The device is designed to provide excellent thermal performance in terms of thermal resistance and power dissipation for applications such as power semiconductor cooling, resistors, and other sensitive components.
The ATS-09F-01-C3-R0 heat sink features an optimized fin design which offers a high performance cooling solution. The fins are designed to be short and wide which allows for greater air flow and better heat dissipation. The fins are also arranged with an even spacing to maximize surface area and increase cooling efficiency. The device also has a tall stand-off that allows for more air flow and better cooling performance. The device is designed for use in operating temperatures between -40℃ to +150℃ which makes it suitable for a wide range of applications.
The working principle of the ATS-09F-01-C3-R0 heat sink is fairly simple. It relies on the process of convection to dissipate heat. Essentially, the heat generated by the electronic components is transferred by hot air rising to the fins of the heat sink. As the hot air passes through the fins, it is cooled by the surrounding atmosphere and then allowed to escape outside. This process of heat transfer can be enhanced by increasing air flow across the fins which increases the surface area for heat dissipation and helps to better dissipate the heat.
The ATS-09F-01-C3-R0 heat sink is designed for a variety of applications including power semiconductor cooling, resistors, and other sensitive components. It is also suitable for LED lighting and heat-generating electronic components. The device’s robust design and high performance ensure reliable operation and optimal thermal performance in even the harshest operating environments. This makes it an ideal solution for anyone looking for a reliable and efficient heat sink for their application.
The specific data is subject to PDF, and the above content is for reference