| Allicdata Part #: | ATS-09F-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-09F-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are an important component of many electronic systems. They are designed to dissipate heat from the system or device so that it can operate at optimal levels and maintain a certain temperature. The ATS-09F-10-C1-R0 Heat Sink is a type of thermal management device that uses thermal radiation and conduction to help dissipate heat from electronic components. In this article, we’ll discuss the application field and working principle of the ATS-09F-10-C1-R0 Heat Sink.
Application Field of ATS-09F-10-C1-R0 Heat Sink
The ATS-09F-10-C1-R0 Heat Sink can be used in both industrial and commercial settings. For example, they are often used in manufacturing to dissipate heat from high-power device and protect components from the extreme temperatures and high power associated with these applications. This type of heat sink is also used in automotive and transportation applications, as well as in medical, military, and consumer electronics.
The ATS-09F-10-C1-R0 Heat Sink is also used in computer systems, because it can dissipate large amounts of heat from components such as CPUs and GPUs. It is also frequently used in larger systems, such as servers, as it can handle bigger loads and provide better heat dissipation. The ATS-09F-10-C1-R0 Heat Sink is also more efficient than other types of heat sinks, making it a popular choice for many applications.
Working Principle of ATS-09F-10-C1-R0 Heat Sink
The ATS-09F-10-C1-R0 Heat Sink works by using thermal radiation and conduction to dissipate heat from electronic components. Thermal radiation is the process of sending out infrared energy from an object that is hotter than the surrounding air. This heat is then absorbed by the environment, helping to cool the object. This type of heat sink is efficient because it has a large surface area, which allows it to disperse more heat than other types of heat sinks.
Conduction is the process of heat being transferred through an object. In the case of the ATS-09F-10-C1-R0 Heat Sink, the heat is conducted from the device or component into the heat sink. The heat sink, with its large surface area, is better able to dissipate that heat, while at the same time providing a cooling effect for the component. This helps to keep it from reaching its maximum temperature and overheating.
The ATS-09F-10-C1-R0 Heat Sink is also designed to be highly efficient. With its efficient design, it is able to dissipate heat more quickly and more effectively than other types of heat sinks. This makes it a popular choice for many different types of applications, such as those mentioned above.
Conclusion
The ATS-09F-10-C1-R0 Heat Sink is an efficient and reliable thermal management device. Its ability to dissipate heat quickly and effectively makes it a great choice for many different types of applications. Its ability to use both thermal radiation and conduction further enhances its reliability and effectiveness. This makes it an ideal choice for many different types of systems and devices.
The specific data is subject to PDF, and the above content is for reference