| Allicdata Part #: | ATS16312-ND |
| Manufacturer Part#: |
ATS-09F-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-09F-10-C2-R0 thermal - heat sink and its many applications are becoming more and more popular. In this article, we will discuss what the ATS-09F-10-C2-R0 is, its application field, and its working principle.
The ATS-09F-10-C2-R0 thermal - heat sink is a low cost option for controlling thermal management of electronic components and systems. This heat sink is designed to provide effective thermal performance and dissipate large amounts of heat while having a small footprint. This makes the ATS-09F-10-C2-R0 a great choice for applications such as consumer electronics, medical, and automotive devices.
The ATS-09F-10-C2-R0 thermal - heat sink is an effective and efficient thermal management solution for various applications. This heat sink is ideal for cooling microprocessors, power amplifiers, supply voltage regulators, motor drivers, and address section and small size pre-amplifiers. The ATS-09F-10-C2-R0 heat sink also uses the latest in energy efficient and robust designs to ensure that the thermal dissipation flow is maximized and long-term performance is maintained.
The application field for the ATS-09F-10-C2-R0 thermal - heat sink can be as diverse as the electronic components it helps to cool. These heat sinks can be used in a variety of applications, including industrial engineering, automotive, aviation, power generation, and military applications. The applications are also diversified within each field, from high power devices to low power microcontrollers. This wide application field ensures that the ATS-09F-10-C2-R0 heat sink can provide effective thermal performance for any application.
The working principle of the ATS-09F-10-C2-R0 thermal - heat sink is based on the law of thermodynamics. This law states that thermal energy flows from a region of higher temperature to a region of lower temperature. The ATS-09F-10-C2-R0 heat sink works on this principle to dissipate heat from the electronic component or system into the surrounding environment. The ATS-09F-10-C2-R0 heat sink also uses a lightweight aluminum base and finned aluminum heatsink to dissipate heat more efficiently. This heatsink is designed to provide effective heat dissipation across a wide range of temperatures.
In summary, the ATS-09F-10-C2-R0 thermal - heat sink is a highly effective and efficient thermal management solution for various applications. It is lightweight and provides a cost-effective solution for cooling a wide range of electronic components and systems. Its application field is diverse and includes industrial engineering, automotive, aviation, power generation, and military applications. The ATS-09F-10-C2-R0 heat sink works on the law of thermodynamics, using a lightweight aluminum base and finned aluminum heatsink to maximize heat dissipation across a wide range of temperatures.
The specific data is subject to PDF, and the above content is for reference