| Allicdata Part #: | ATS-09F-108-C1-R1-ND |
| Manufacturer Part#: |
ATS-09F-108-C1-R1 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-108-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to transfer heat away from an area to ensure that it does not become too hot and damage other components. Heat sinks play an important role in the operation of many electronic devices. The ATS-09F-108-C1-R1 heat sink is a thermally-controlled device that helps maintain optimum temperature levels and protect the electronic components in systems such as computers, industrial equipment, and medical devices.
The ATS-09F-108-C1-R1 heat sink is a thermally-controlled device that helps maintain optimum temperature levels and protect the electronic components in systems such as computers, industrial equipment, and medical devices. This type of heat sink is designed to transfer heat away from the component or system by dissipating it into the surrounding environment. The heat sink contains fins that allow the air to circulate around the components to help dissipate the heat more effectively.
The thermal design of the ATS-09F-108-C1-R1 helps ensure the safe operation of electronic systems. This type of heat sink is designed to provide high performance thermal management by dissipating high levels of heat away from critical components. It is made of high grade aluminum and features an innovative multi-layer structure that helps reduce the temperature of the components inside. This type of heat sink is able to dissipate heat quickly and efficiently while providing superior protection to the components.
The ATS-09F-108-C1-R1 heat sink works by transferring the heat generated by the components to the surrounding environment. The fins on the heat sink are designed to facilitate the transfer of heat away from the components. The heat from the components is dissipated into the surrounding environment through the fins, which helps reduce the temperature of the components inside. This helps ensure that the components are not damaged by overheating.
The ATS-09F-108-C1-R1 heat sink is designed to be installed in a variety of electronic systems. It is suitable for use in computers, industrial equipment, and medical devices. It is easy to install and can be used in both dry and wet applications. It is also engineered to reduce the operational noise levels when installed, which is important for quiet operation in many applications.
The ATS-09F-108-C1-R1 thermal management system is a reliable and efficient solution for controlling the temperature of components in a wide range of applications. It is designed to provide high levels of performance while protecting the components from damage caused by overheating. The heat sink is easy to install and is suitable for use in both dry and wet applications. It is an ideal choice for those who need an effective thermal management solution.
The specific data is subject to PDF, and the above content is for reference