
Allicdata Part #: | ATS-09F-111-C1-R1-ND |
Manufacturer Part#: |
ATS-09F-111-C1-R1 |
Price: | $ 5.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 60X40X9.5MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.90455 |
30 +: | $ 4.63176 |
50 +: | $ 4.35935 |
100 +: | $ 4.08694 |
250 +: | $ 3.81448 |
500 +: | $ 3.54201 |
1000 +: | $ 3.47390 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 2.362" (60.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.374" (9.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 26.72°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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The ATS-09F-111-C1-R1 heat sinks are a form of thermal management system designed specifically for use in a variety of electrical and electronic applications. They are characterized by their high performance and efficient cooling capacity, making them a popular choice for professionals in the industry.
Heat sinks are designed to dissipate heat from a variety of different electrical components, including transistors, transformers, regulators, diodes, resistors, and other semiconductor devices. The ATS-09F-111-C1-R1 system uses an aluminum-based finned structure that dissipates heat quickly and efficiently. The fins absorb heat from the component and then transfer it to the surrounding air. This helps to keep the component at an ideal operating temperature for optimum performance.
The ATS-09F-111-C1-R1 thermal management system is specifically designed for use in a wide range of applications, from automotive power systems to consumer electronics. These heat sinks are designed to work with a variety of different circuit boards, including single-layer, multi-layer, and rigid-flex substrates. This flexibility allows for greater control when optimizing thermal performance in an application.
When designing with these heat sinks, designers need to consider the thermal resistance of the substrate and components, as well as the working environment. This allows the designer to calculate the ideal size and number of fins to maximize performance. Generally, the best performance is achieved when the fins are spaced closely together in a radial pattern, so that the heat from the component is more evenly distributed to the surrounding air.
In addition to the aluminum-based finned structure, the ATS-09F-111-C1-R1 system also uses a heatsink interface to connect the fins to the substrate and ensure optimal thermal transfer. This interface material helps to reduce the thermal resistance between the fins and the substrate surface, allowing for increased efficiency in heat dissipation.
The design of the ATS-09F-111-C1-R1 system also ensures that it can operate in high-temperature environments. The outlet air temperature can range from -40°C to +155°C, making it suitable for use in both industrial and consumer-grade applications.
Overall, the ATS-09F-111-C1-R1 system is an excellent choice for thermal management in a variety of different applications. With its high performance and efficient cooling capacity, professionals in the industry can rest assured that their components will be working at their optimal operating temperature.
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