ATS-09F-14-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09F-14-C1-R0-ND

Manufacturer Part#:

ATS-09F-14-C1-R0

Price: $ 3.68
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09F-14-C1-R0 datasheetATS-09F-14-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.34026
30 +: $ 3.25017
50 +: $ 3.06974
100 +: $ 2.88912
250 +: $ 2.70857
500 +: $ 2.61828
1000 +: $ 2.34741
Stock 1000Can Ship Immediately
$ 3.68
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.96°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-09F-14-C1-R0 thermal-heat sink is a device commonly used to manage the thermal performance of sensitive electronic equipment. This technology offers an improved operating environment for electronic circuits and systems. The ATS-09F-14-C1-R0 is a cost-efficient way to dissipate generated heat and prevent electronic devices from overheating.

The ATS-09F-14-C1-R0 thermal-heat sink is designed to have maximum thermal performance. Its anodized aluminum alloy construction has a large number of small fins which increases the amount of surface area available for the air to circulate and dissipate the heat. The fins also help to distribute heat evenly, which is important for preventing localized hot spots which can reduce component life. The ATS-09F-14-C1-R0 also features a thermal connector which enables direct installation of cooling fans and other components for high performance.

The ATS-09F-14-C1-R0 is also known as a “self-regulating” thermal-heat sink. This means that it is designed to have a certain amount of thermal conductivity and is capable of automatically adjusting its own performance based on the temperature of its surrounding environment. This is done through the use of a thermistor, which is a specialized temperature-sensing component. The thermistor will cause the thermal-heat sink to heat up between a certain range of temperatures and cool down when the temperature is outside of this range. This ensures that the device operates within the optimal temperature range to avoid overheating.

The ATS-09F-14-C1-R0 thermal-heat sink is typically used in electronic devices that generate large amounts of heat. Some examples include 3D printers, server racks, computer motherboards, and laser cutting machines. This device is also used in industrial settings, such as with food processing equipment and in motor control systems. In these applications, the ATS-09F-14-C1-R0 is capable of providing a safe and reliable working environment. It is also suitable for use in domestic applications such as in air-conditioning systems or refrigerators.

The ATS-09F-14-C1-R0 is designed to be easy to install and maintain. It can be mounted in a variety of ways, such as with clips, screws, or rivets. Depending on the size of the device, it can be mounted onto walls, floors, or cabinets. It is also easy to replace as no tools are required for installation. In addition, the thermal-heat sink does not require any additional power supply to work.

The ATS-09F-14-C1-R0 thermal-heat sink is an invaluable tool in the management of thermal performance of sensitive electronic equipment. Its anodized aluminum construction and its self-regulating design allow it to provide reliable performance and ensure that device temperatures remain within the optimal range. The device is also easy to install and maintain, making it suitable for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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