| Allicdata Part #: | ATS-09F-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-09F-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-09F-145-C1-R0 thermal solution is a heat sink designed to provide effective thermal management for a variety of applications. It is a high performance heat sink that is designed to facilitate heat dissipation and efficient cooling in a broad range of settings. The ATS-09F-145-C1-R0 utilizes a combination of skived aluminum fins, heat pipes, and vapor chambers to maximize heat transfer and keep operating temperatures low.
The skived aluminum fin structure of the ATS-09F-145-C1-R0 is unique in that it allows for maximum flow of air and efficient heat dissipation. The skived fin construction directs air to flow along the length of the heat sink for more effective cooling. The combination of heat pipes and vapor chambers provides significantly better heat transfer capabilities than traditional heat sinks. This allows the ATS-09F-145-C1-R0 to manage higher temperatures and dissipate heat more effectively than most other heat sink designs.
The ATS-09F-145-C1-R0 has an extremely efficient design that requires less space than traditional heat sinks. This makes it particularly suitable for applications where space is at a premium. The heat sink is also designed with an integrated mounting system that makes installation easier and more reliable. This is especially advantageous for applications that require frequent maintenance or need to be replaced frequently.
The ATS-09F-145-C1-R0 can be used in a variety of thermal management applications, including portable electronics, CPUs and GPUs, as well as consumer products. In these applications, the ATS-09F-145-C1-R0 is designed to provide effective cooling and heat dissipation while maintaining a low profile. The heat sink\'s low profile design allows it to fit into many tight spaces, while its high performance capabilities make it ideal for a variety of performance demanding applications.
The ATS-09F-145-C1-R0 thermal solution has been designed to address a wide range of thermal management challenges. Its combination of skived aluminum fins, heat pipes, and vapor chambers ensure effective cooling and heat transfer, while its low profile design make it suitable for many space-constrained applications. The integrated mounting system makes it easy to install and maintain the heat sink, making it an ideal choice for a variety of thermal management needs.
The specific data is subject to PDF, and the above content is for reference