| Allicdata Part #: | ATS-09F-152-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-152-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-152-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are integral components that help the components of a device, system, or machine dissipate heat. The ATS-09F-152-C3-R0, in particular, is a heat sink designed to dissipate heat from various electronic components, such as CPUs and other integrated circuits, as well as other thermally sensitive electronic parts. It is an ideal component for cooling high-powered chipsets and graphics processing units, as well as other types of electronic devices.
The ATS-09F-152-C3-R0 is an aluminum finned heat sink constructed with a copper core and contains staggered, interlocking fins. These fins increase the surface area so that more heat can be dissipated from the component. The design also improves the air circulation within the heat sink, allowing it to be even more effective at dissipating heat. Additionally, the core of the heat sink is pre-drilled with mounting holes and is able to accommodate several types of mounting styles, such as vertical, horizontal, and top-down mounting.
The ATS-09F-152-C3-R0 is also equipped with thermal transfer plates, which allow it to dissipate heat more effectively. The plates are made of high-quality copper and have complex patterns and grooves on their surface. These patterns dramatically increase the area that is in contact with the components, enabling heat to be dissipated more quickly and efficiently.
In terms of efficiency, the ATS-09F-152-C3-R0 features two zero-resistance heat pipe fans, which can accelerate the heat dissipation process. The fans also keep the component cooler, permitting them to work at their maximum thermal efficiency. Additionally, the heat pipe fan assembly is covered with a black nickel finish to prevent corrosion and ensure stability.
The ATS-09F-152-C3-R0 can be used in a variety of applications, such as medical devices, automotive electronics, computers, and other electronic products. It is ideal for high-powered device applications, such as CPUs, GPUs, chipsets, and other types of integrated circuits. It is also suitable for cooling thermally sensitive devices, such as power switches and control circuits. The heat sink is designed with a universal mounting style, making it easy to install in various devices.
Overall, the ATS-09F-152-C3-R0 is an optimal heat sink, suitable for devices that require intensive cooling. Its use of thermal transfer plates, zero-resistance fans, and mounting holes make it a reliable and efficient component for dissipating heat from different types of electronic components. Furthermore, its universal mounting style allows for easy installation in various devices.
The specific data is subject to PDF, and the above content is for reference