ATS-09F-178-C3-R0

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Thermal management products are becoming increasingly important in the electrical and electronic equipment industry, providing solutions to control the temperature of various electronic components and assemblies and help maintain their normal operation. ATS-09F-178-C3-R0, a type of thermal-heat sink, is widely used in this field.

A thermal-heat sink is a device that quickly transfers heat away from a hot component, such as an integrated circuit, by dissipating it into the ambient air. ATS-09F-178-C3-R0 is a high-performance heat sink made of aluminum alloy, characterized by good heat dissipation effect, low thermal resistance, narrow profile, and stable performance. Its thermal conductivity is 173 W/m·K, thermal resistance is 0.408°C/W, base area is 81 cm², thickness is 17.8 mm, and working temperature range is -65°C to +150°C.

ATS-09F-178-C3-R0 is widely used in applications such as motor controllers, relays, solid state drives (SSDs), and automotive electronics. These applications require a thermal-heat sink designed to dissipate the heat generated by electronic components and maintain their optimal temperature, while also occupying a small amount of space.

The working principle of ATS-09F-178-C3-R0 is based on a heat transfer system. Heat generated by the component is transferred to the aluminum alloy\'s thermal conductivity along the base plate and fins of the heat sink. The aluminum alloy has a high thermal conductivity, which allows it to effectively absorb and dissipate heat. As the heat dissipates into the air, it is dissipated away from the component and the temperature is kept within the specified range.

Once the heat sink is attached to the component, the low thermal resistance ensures rapid heat transfer between the component and the heat sink, while the air flow and convection exchange around the fins improves the cooling effect. Furthermore, when the heat sink is fixed to the component, the fins act as a shield to prevent humidity, dust, and other contaminants from entering the heat sink and affecting its performance.

In addition, the steel bracket and pressure-fit placement also help to enhance its stability and contact with the component. The pressure-fit fitting is designed to securely clamp and hold the heat sink, ensuring good contact between the base and the component, minimising the effect of mechanical vibration, and minimising the potential of unwanted component movement and possible damage.

As an effective thermal management device, ATS-09F-178-C3-R0 and other heat sinks are playing an increasingly important role in the electrical and electronic equipment industry. They serve as a reliable solution for controlling heat and helping maintain the normal temperature and performance of electronic components and assemblies.

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