| Allicdata Part #: | ATS-09F-18-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-18-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-18-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are an important part of thermal management and cooling solutions. They are used to help dissipate heat away from sensitive components, and can be made from a variety of different materials such as aluminum, copper and plastic. One such heat sink that is popular in the industry is the ATS-09F-18-C3-R0. This heat sink is designed for small, low power applications such as Raspberry Pi, Arduino, and Intel NUC mini-PCs.
The ATS-09F-18-C3-R0 is a lightweight, low-profile aluminum heat sink that is designed to be used in small, compact applications. It is a compact, low profile design measuring only 9mm x 18mm x 12mm and weighs just 9.9 grams. It is made from high quality aluminum and has excellent thermal conductivity (0.7W/mK).
The ATS-09F-18-C3-R0 is designed to be used in applications where air flow is limited. It has a low profile and low weight design that allows it be used in tight spaces and integrated into small devices. It is also designed to be used in applications where cooling is required but cooling fans are not an option. This makes it a great choice for applications such as Raspberry Pi, Arduino, and Intel NUC mini-PCs.
The ATS-09F-18-C3-R0 is designed to be used in conjunction with dedicated cooling solutions. It is compatible with both active and passive cooling solutions and can be used with thermal interface materials and adhesives. It is also designed to be used with fanless cooling solutions, such as liquid cooling systems or thin-film heat spreaders.
The ATS-09F-18-C3-R0 is an effective thermal management tool, as it is designed to be used in highly constrained thermal environments and is capable of efficiently dissipating heat away from components. This makes it an ideal solution for applications that require a reliable, effective cooling solution.
The ATS-09F-18-C3-R0 is an effective and efficient thermal management solution for small, low power systems. It is lightweight, compact and designed to be used in tight spaces and highly constrained thermal environments. It is also compatible with both active and passive cooling solutions and can be used with thermal interface materials and adhesives.
The specific data is subject to PDF, and the above content is for reference