| Allicdata Part #: | ATS-09F-195-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-195-C3-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-195-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.10275 |
| 30 +: | $ 3.01896 |
| 50 +: | $ 2.85125 |
| 100 +: | $ 2.68349 |
| 250 +: | $ 2.51579 |
| 500 +: | $ 2.43193 |
| 1000 +: | $ 2.18034 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a type of heat transfer component used in a wide array of applications. The ATS-09F-195-C3-R0 is one such component, which is designed to efficiently transfer heat from the source of origin, such as a semiconductor, to the surrounding environment. It is used in a variety of applications and industries, ranging from medical and consumer electronics to telecommunication equipment and aerospace engineering.
The ATS-09F-195-C3-R0 is a heat-sink featuring a die-cast aluminum construction, meaning that it is manufactured using a molding process wherein molten aluminum is poured and cooled into a tailor-made mold chamber. The cooling fins offer an increased surface area to enhance heat dissipation. The device features a 95-mil thickness, an overall length of 2-3/4 inches, and a width of 2-1/4 inches.
The basic working principle of the ATS-09F-195-C3-R0 is to transfer thermal energy from one component to another. Heat is generated from the source, such as a semiconductor, and is absorbed by the heat-sink. As it passes through the heat-sink, the heat is dissipated away from the solid component, such as a flat heat-spreader or a heat sink pad. The dissipated heat is then either radiated into the air, or transferred to a heat exchanger or another dissipating component.
The ATS-09F-195-C3-R0 can be used in a variety of applications, such as medical, consumer electronics, telecommunication equipment, aerospace engineering, automotive, and more. In the medical industry,A heat-sink such as the ATS-09F-195-C3-R0 can be used to cool diagnostic and imaging equipment. In consumer electronics, it can be used to cool laptop computers and other consumer products. In telecommunications, it can be used to cool base stations and transmitters, or other communication equipment. In the aerospace industry, it can be used to cool aircraft electronics such as avionics and other equipment. In automotive, it can be used to cool electric motors, air-conditioners, and other automotive components.
In conclusion, the ATS-09F-195-C3-R0 Heat Sink is an effective, efficient, and reliable heat transfer device that can be used in many different applications. Its construction of die-cast aluminum and cooling fins ensures that it can readily dissipate heat away from a heat source. Its wide array of applications in different industries demonstrates the effectiveness and reliability of the ATS-09F-195-C3-R0 in managing heat.
The specific data is subject to PDF, and the above content is for reference