| Allicdata Part #: | ATS-09F-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-09F-200-C3-R0 is a thermal-heat sink engineered to maintain safe operating temperatures as heat is drawn away from the device via a heat pipe. The heatsink works by efficiently transferring heat from motors, engines, and enclosures into the surrounding air, keeping components from overheating and malfunctioning. By drawing heat from these sources, the ATS-09F-200-C3-R0 allows for improved efficiency, better reliability, and extended component lifespan.
The ATS-09F-200-C3-R0 consists of a base and fins, both made of aluminum. The base of the heatsink serves as a foundation for the fins, which are arranged in a grid-like pattern to maximize air flow. The fins are spaced with very small gaps to allow for optimal heat transfer. The base is also manufactured with a layer of insulating material to prevent short-circuiting or any other potential issues related to direct contact with electrical components.
Heatsinks like the ATS-09F-200-C3-R0 are typically affixed to the device they are protecting through a mechanical attachment or adhesive to ensure that no air gaps or leaks exist between the device and the heatsink. This allows the heat generated by the device to be drawn away quickly and effectively, ensuring that the operating temperature remains within safe limits.
The ATS-09F-200-C3-R0 features a high-performance cooling fan which helps to further improve the efficiency of the device by actively pushing air through the fins of the heatsink. The fan also helps to keep dust, dirt and debris at bay from build-up which could otherwise compromise the cooling efficiency of the device.
The ATS-09F-200-C3-R0 provides excellent thermal insulation and improved heat transfer at any given power level. Thanks to its efficient design, it is able to draw heat away from components faster and more effectively than conventional heatsinks, resulting in improved system performance and extended device lifespan.
The ATS-09F-200-C3-R0 is designed for use in a variety of applications, from laptop computers and game consoles to industrial equipment and automotive applications. It is also suitable for outdoor applications where it will be exposed to the elements and extreme temperature fluctuations.
In summary, the ATS-09F-200-C3-R0 is an effective thermal-heat sink designed to keep components running reliably and safely in any environment. Its efficient design makes it an excellent choice for industrial, outdoor and automotive applications, where heat must be effectively and quickly transferred away from sensitive components.
The specific data is subject to PDF, and the above content is for reference