| Allicdata Part #: | ATS16426-ND |
| Manufacturer Part#: |
ATS-09F-203-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-203-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 4.21000 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
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Thermal management is an important component of any electronic system. It is responsible for the efficient dissipation of heat generated by the components of the system to ensure the integrity and stability of the system. The ATS-09F-203-C2-R0 is a one-piece aluminum heat sink designed for efficient heat dissipation. It has several applications and a working principle.
The ATS-09F-203-C2-R0 heat sink comes with a combination of fin structure and internal heat pipe technology to provide efficient thermal dissipation. Its surface has an anodized finish with an electroless nickel finish for additional corrosion protection. It features a low profile design to ensure compatibility with air gaps, helping to maximize air flow and heat dissipation. The ATS-09F-203-C2-R0 has a maximum computing power of 7.1 W and is designed to dissipate heat from an average power of 2.0 W. It is compatible with various chipsets and processors.
The ATS-09F-203-C2-R0 heat sink is suitable for numerous applications. It is designed for use in small devices such as tablets, laptops, cell phones and wearables. It is also suitable for consumer electronics, automotive electronics, embedded systems and medical devices. It can also be used in thermal management of power electronics, high-frequency power supplies, liquid cooling systems and other temperature-sensitive applications.
The ATS-09F-203-C2-R0 heat sink works by dissipating heat from the source. Heat is generated because the components of the electronic system transform electrical energy into thermal energy due to Joule-Thomson effect. The heat sink dissipates heat by exchanging it with the surrounding environment through convection, radiation and conduction. It dissipates the heat from the source and cools down the source, thus enhancing the performance and reliability of the system.
The ATS-09F-203-C2-R0 heat sink is designed for heat dissipation from an average power of 2.0 W and a maximum computing power of 7.1 W. It is compatible with various chipsets and processors, making it suitable for multiple applications such as tablets, laptops, cell phones, wearables, consumer electronics, automotive electronics, embedded systems and medical devices. Its combination of fin structure and heat pipe technology helps to efficiently dissipate heat. The ATS-09F-203-C2-R0 is a reliable and efficient thermal solution for temperature-sensitive applications.
The specific data is subject to PDF, and the above content is for reference